SLVSD05G March   2016  – August 2024 TPS56C215

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  PWM Operation and D-CAP3™ Control Mode
      2. 6.3.2  Eco-mode Control
      3. 6.3.3  4.7-V LDO
      4. 6.3.4  MODE Selection
      5. 6.3.5  Soft Start and Prebiased Soft Start
      6. 6.3.6  Enable and Adjustable UVLO
      7. 6.3.7  Power Good
      8. 6.3.8  Overcurrent Protection and Undervoltage Protection
      9. 6.3.9  UVLO Protection
      10. 6.3.10 Thermal Shutdown
      11. 6.3.11 Output Voltage Discharge
    4. 6.4 Device Functional Modes
      1. 6.4.1 Light Load Operation
      2. 6.4.2 Standby Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 External Component Selection
          1. 7.2.2.1.1 Output Voltage Set Point
          2. 7.2.2.1.2 Switching Frequency and MODE Selection
          3. 7.2.2.1.3 Inductor Selection
          4. 7.2.2.1.4 Output Capacitor Selection
          5. 7.2.2.1.5 Input Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Marking

7.4.1 Layout Guidelines

  • Recommend a four-layer or six-layer PCB for good thermal performance and with maximum ground plane. 3" × 3", four-layer PCB with 2-oz. copper used as example.
  • Recommend having equal caps on each side of the IC. Place them right across VIN as close as possible.
  • Inner layer 1 is ground with the PGND to AGND net tie
  • Inner layer2 has VIN copper pour that has vias to the top layer VIN. Place multiple vias under the device near VIN and PGND and near input capacitors to reduce parasitic inductance and improve thermal performance
  • Bottom later is GND with the BOOT trace routing.
  • Reference feedback to the quite AGND and routed away from the switch node.
  • Make VIN trace wide to reduce the trace impedance.