SLVSDH0C December   2016  – January 2018 TPS22810

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical DC Characteristics
    8. 7.8 Typical AC Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 On and Off Control
      2. 9.3.2 Quick Output Discharge (QOD)
        1. 9.3.2.1 QOD when System Power is Removed
        2. 9.3.2.2 Internal QOD Considerations
      3. 9.3.3 EN/UVLO
      4. 9.3.4 Adjustable Rise Time (CT)
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 ON and OFF Control
    3. 10.3 Input Capacitor (Optional)
    4. 10.4 Output Capacitor (Optional)
    5. 10.5 Typical Application
      1. 10.5.1 Design Requirements
      2. 10.5.2 Detailed Design Procedure
        1. 10.5.2.1 Shutdown Sequencing During Unexpected Power Loss
        2. 10.5.2.2 VIN to VOUT Voltage Drop
        3. 10.5.2.3 Inrush Current
      3. 10.5.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Developmental Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

7.6 Switching Characteristics

Refer to the timing test circuit in Figure 16 (unless otherwise noted) for references to external components used for the test condition in the switching characteristics table. Switching characteristics shown below are only valid for the power-up sequence where VIN is already in steady state condition before the EN/UVLO pin is asserted high.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN = 18 V, VEN/UVLO = 5 V, TA = 25 °C (unless otherwise noted)
tON Turnon time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 520 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 3.3
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 700
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 2
tD Delay time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 180
VIN = 12 V, VEN/UVLO = 5 V, TA = 25 °C (unless otherwise noted)
tON Turnon time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 380 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 3.3
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 460
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 2
tD ON delay time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 150
VIN = 3.3 V, VEN/UVLO = 5 V, TA = 25 °C (unless otherwise noted)
tON Turnon time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 185 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 3.3
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 120
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 2
tD ON delay time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 130