SLVSDM4D November 2018 – December 2019 TPS1HA08-Q1
PRODUCTION DATA.
To achieve optimal thermal performance, connect the exposed pad to a large copper pour. On the top PCB layer, the pour may extend beyond the pad dimensions as shown in the example below. In addition to this, it is recommended to also have a VBB plane either on one of the internal PCB layers or on the bottom layer. Vias should connect this plane to the top VBB pour.
has 6 VOUT pins. All VOUT pins must be shorted together on the PCB. Additionally, the layout should ensure that the current path is symmetrical for both sides of the device. If the path is not symmetrical, there will be some imbalance in current spreading across the power FET. This can impact accuracy of the current sense measurement.