SLVSDO6C August 2017 – June 2019 TPS1H000-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | TPS1H000-Q1 | UNIT | |
---|---|---|---|
DGN (HVSSOP) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 49.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 50.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 21.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 21.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.1 | °C/W |