SLVSDR8B April   2018  – February 2023 TPS62147 , TPS62148

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Schematic
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Precise Enable
      2. 9.3.2 Power Good (PG)
      3. 9.3.3 MODE
      4. 9.3.4 Undervoltage Lockout (UVLO)
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pulse Width Modulation (PWM) Operation
      2. 9.4.2 Power Save Mode Operation (PWM/PFM)
      3. 9.4.3 100% Duty-Cycle Operation
      4. 9.4.4 Current Limit And Short Circuit Protection (for TPS62148)
      5. 9.4.5 HICCUP Current Limit And Short Circuit Protection (for TPS62147)
      6. 9.4.6 Soft Start / Tracking (SS/TR)
      7. 9.4.7 Output Discharge Function (TPS62148 only)
      8. 9.4.8 Starting into a Pre-Biased Load
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Programming the Output Voltage
      2. 10.1.2 External Component Selection
      3. 10.1.3 Inductor Selection
      4. 10.1.4 Capacitor Selection
        1. 10.1.4.1 Output Capacitor
        2. 10.1.4.2 Input Capacitor
        3. 10.1.4.3 Soft-Start Capacitor
      5. 10.1.5 Tracking Function
      6. 10.1.6 Output Filter and Loop Stability
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application with Adjustable Output Voltage
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 LED Power Supply
      2. 10.3.2 Powering Multiple Loads
      3. 10.3.3 Voltage Tracking
      4. 10.3.4 Precise Soft-Start Timing
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
      3. 10.5.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TPS62147, TPS62148UNIT
RGX (VQFN)
11 PINS
RθJAJunction-to-ambient thermal resistance38.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance2.0°C/W
RθJBJunction-to-board thermal resistance7.6°C/W
ψJTJunction-to-top characterization parameter0.1°C/W
ψJBJunction-to-board characterization parameter7.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.