SLVSE31C January   2018  – July 2018 TPSM84209

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (VIN = 5 V)
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 24 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Input Capacitor Selection
      3. 7.3.3  Undervoltage Lockout (UVLO)
      4. 7.3.4  Output Capacitor Selection
      5. 7.3.5  Feed-Forward Capacitor
      6. 7.3.6  Operating Range
      7. 7.3.7  Output Current Rating
      8. 7.3.8  Enable (EN)
      9. 7.3.9  Internal Soft Start
      10. 7.3.10 Safe Start-Up Into Prebiased Outputs
      11. 7.3.11 Light Load Efficiency / Eco-Mode
      12. 7.3.12 Voltage Dropout
      13. 7.3.13 Overcurrent Protection
      14. 7.3.14 Output Overvoltage Protection (OVP)
      15. 7.3.15 Thermal Performance
      16. 7.3.16 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Eco-Mode Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Capacitors
        5. 8.2.2.5 Enable Control
      3. 8.2.3 Application Waveforms
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
      1. 10.3.1 EMI Plots
    4. 10.4 Package Specifications
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Custom Design With WEBENCH® Tools
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

6.1 Absolute Maximum Ratings

Over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN –0.3 30 V
EN, FB –0.3 7 V
Output voltage SW –0.3 30 V
SW (20 ns transient) –5 30 V
VOUT –0.3 7 V
Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20 to 2000 Hz 20 G
Operating IC junction temperature, TJ(2) –40 125 °C
Operating ambient temperature, TA(2) –40 85 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under the recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.