SLVSE84D December   2017  – July 2021 TLV767

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable
      2. 8.3.2 Dropout Voltage
      3. 8.3.3 Foldback Current Limit
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Output Pulldown
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Functional Mode Comparison
      2. 8.4.2 Normal Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Adjustable Device Feedback Resistors
      2. 9.1.2 Recommended Capacitor Types
      3. 9.1.3 Input and Output Capacitor Requirements
      4. 9.1.4 Reverse Current
      5. 9.1.5 Feed-Forward Capacitor (CFF)
      6. 9.1.6 Power Dissipation (PD)
      7. 9.1.7 Estimating Junction Temperature
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Response
        2. 9.2.2.2 Choose Feedback Resistors
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

11.1 Layout Guidelines

  • Place input and output capacitors as close to the device as possible
  • Use copper planes for device connections to IN, OUT, and GND pins to optimize thermal performance
  • Place thermal vias around the device to distribute heat