SLVSEI1C June 2019 – October 2020 TPS62864 , TPS62866
PRODUCTION DATA
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component.
Two basic approaches for enhancing thermal performance are improving the power dissipation capability of the PCB design and introducing airflow in the system. For more details on how to use the thermal parameters, see the Semiconductor and IC Package Thermal Metrics Application Report.