SLVSF65A December   2020  – May 2021 TPS92633-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply (SUPPLY)
        1. 7.3.1.1 Power-On Reset
        2. 7.3.1.2 Supply Current in Fault Mode
      2. 7.3.2  Enable and Shutdown (EN)
      3. 7.3.3  Reference Current (IREF)
      4. 7.3.4  Constant-Current Output and Setting (INx)
      5. 7.3.5  Analog Current Control (ICTRL)
        1. 7.3.5.1 Off-Board Brightness Binning Resistor
        2. 7.3.5.2 NTC Resistor
      6. 7.3.6  Thermal Sharing Resistor (OUTx and RESx)
      7. 7.3.7  PWM Control (PWMx)
      8. 7.3.8  Supply Control
      9. 7.3.9  Diagnostics
        1. 7.3.9.1 IREF Short-to-GND Detection
        2. 7.3.9.2 IREF Open Detection
        3. 7.3.9.3 LED Short-to-GND Detection
        4. 7.3.9.4 LED Open-Circuit Detection
        5. 7.3.9.5 Single LED Short-Circuit Detection (SLS_REF)
        6. 7.3.9.6 LED Open-Circuit and Single LED Short-Circuit Detection Enable (DIAGEN)
        7. 7.3.9.7 Low Dropout Operation
        8. 7.3.9.8 Over-Temperature Protection
      10. 7.3.10 FAULT Bus Output With One-Fails–All-Fail
      11. 7.3.11 FAULT Table
      12. 7.3.12 LED Fault Summary
      13. 7.3.13 IO Pins Inner Connection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
      2. 7.4.2 Normal Operation V(SUPPLY) ≥ 4.5 V
      3. 7.4.3 Low-Voltage Dropout Operation
      4. 7.4.4 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 BCM Controlled Rear Lamp with One-Fails-All-Fail Setup
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Independent PWM Controlled Rear Lamp with Off Board LED and Binning Resistor
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

10.1 Layout Guidelines

Thermal dissipation is the primary consideration for TPS92633-Q1 layout.

  • TI recommends large thermal dissipation area in both top and bottom layers of PCB. The copper pouring area in same layer with TPS92633-Q1 footprint should directly cover the thermal pad land of the device with wide connection as much as possible. The copper pouring in opposite PCB layer or inner layers should be connected to thermal pad directly through multiple thermal vias.
  • TI recommends to place R(RESx) resistors away from the TPS92633-Q1 device with more than 20-mm distance because R(RESx) resistors are dissipating some amount of the power as well as the TPS92633-Q1. It is better to place two heat source components apart to reduce the thermal accumulation concentrated at small PCB area. The large copper pouring area is also required surrounding the R(RESx) resistors for helping thermal dissipating.

The noise immunity is the secondary consideration for TPS92633-Q1 layout.

  • TI recommends to place the noise decoupling capacitors for SUPPLY, ICTRL and IREF pins as close as possible to the pins.
  • TI recommends to place the R(SNSx) resistor as close as possible to the INx pins with the shortest PCB track to SUPPLY pin.