SLVSFE3C November 2020 – December 2021 TPS2661
PRODUCTION DATA
THERMAL METRIC(1) | TPS2661 | UNIT | |
---|---|---|---|
DDF (SOT-23-THN) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 117.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 57.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 40.2 | °C/W |
ΨJT | Junction-to-top characterization parameter | 2.2 | °C/W |
ΨJB | Junction-to-board characterization parameter | 40 | °C/W |