SLVSFP1 August   2021 TPS25868-Q1 , TPS25869-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Power-Down or Undervoltage Lockout
      2. 10.3.2  Input Overvoltage Protection (OVP) - Continuously Monitored
      3. 10.3.3  Buck Converter
      4. 10.3.4  FREQ/SYNC
      5. 10.3.5  Bootstrap Voltage (BOOT)
      6. 10.3.6  Minimum ON-Time, Minimum OFF-Time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Selectable Output Voltage (VSET)
      9. 10.3.9  Current Limit and Short Circuit Protection
        1. 10.3.9.1 USB Switch Programmable Current Limit (ILIM)
        2. 10.3.9.2 Interlocking for Two-Level USB Switch Current Limit
        3. 10.3.9.3 Cycle-by-Cycle Buck Current Limit
        4. 10.3.9.4 OUT Current Limit
      10. 10.3.10 Cable Compensation
      11. 10.3.11 Thermal Management with Temperature Sensing (TS) and OTSD
      12. 10.3.12 Thermal Shutdown
      13. 10.3.13 USB Enable On/Off Control (TPS25869-Q1)
      14. 10.3.14 FAULT Indication
      15. 10.3.15 USB Specification Overview
      16. 10.3.16 USB Type-C® Basics
        1. 10.3.16.1 Configuration Channel
        2. 10.3.16.2 Detecting a Connection
      17. 10.3.17 USB Port Operating Modes
        1. 10.3.17.1 USB Type-C® Mode
        2. 10.3.17.2 Dedicated Charging Port (DCP) Mode (TPS25868-Q1 Only)
          1. 10.3.17.2.1 DCP BC1.2 and YD/T 1591-2009
          2. 10.3.17.2.2 DCP Divider-Charging Scheme
          3. 10.3.17.2.3 DCP 1.2-V Charging Scheme
        3. 10.3.17.3 DCP Auto Mode (TPS25868-Q1)
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Output Voltage Setting
        2. 11.2.2.2 Switching Frequency
        3. 11.2.2.3 Inductor Selection
        4. 11.2.2.4 Output Capacitor Selection
        5. 11.2.2.5 Input Capacitor Selection
        6. 11.2.2.6 Bootstrap Capacitor Selection
        7. 11.2.2.7 Undervoltage Lockout Set-Point
        8. 11.2.2.8 Cable Compensation Set-Point
        9. 11.2.2.9 FAULT Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Ground Plane and Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

8.4 Thermal Information

THERMAL METRIC(1)(2) TPS2586x-Q1 UNIT
RPQ (VQFN)
25 PINS
RθJA Junction-to-ambient thermal resistance 30 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.6 °C/W
RθJB Junction-to-board thermal resistance 7.2 °C/W
ΨJT Junction-to-top characterization parameter 1 °C/W
ΨJB Junction-to-board characterization parameter 7.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Power rating at a specific ambient temperature TA should be determined with a maximum junction temperature of 150 °C.