SLVSFR3B april   2022  – june 2023 TPSI2140-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Avalanche Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Dielectric Withstand Testing (HiPot)
      2. 9.2.2 Design Requirements
      3. 9.2.3 Design Procedure - Chassis Ground Reference
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC (1) DEVICE UNIT
DWQ (SOIC)
11 PINS
RϴJA Junction-to-ambient thermal resistance 70 °C/W
RϴJA, EVM, 60S Junction-to-ambient thermal resistance(2)(3) 52 °C/W
RϴJA, EVM, 5S Junction-to-ambient thermal resistance(2)(4) 30 °C/W
RϴJB Junction-to-board thermal resistance 22 °C/W
RϴJC(top) Junction-to-case (top) thermal resistance 26 °C/W
ψJT Junction-to-top characterization parameter 14 °C/W
ΨJB Junction-to-board characterization parameter 21 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) EVM PCB dimensions are 74.25mm x 43mm x 1mm.  4 layer PCB with 2oz Cu on layers 1,4 and 1oz Cu on layer 2,3.
(3) Performance of EVM with power applied for 60s.
(4) Performance of EVM with power applied for 5s.