SLVSFR3B april   2022  – june 2023 TPSI2140-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Avalanche Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Dielectric Withstand Testing (HiPot)
      2. 9.2.2 Design Requirements
      3. 9.2.3 Design Procedure - Chassis Ground Reference
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

6.8 Safety Limiting Values

PARAMETER(1)(2) TEST CONDITIONS MIN TYP MAX UNIT
IS Safety VDD Current RθJA = 70°C/W, VVDD = 20 V,
TJ = 150°C, TA = 25°C		 77 mA
Safety Switch Current (On State) RθJA = 70°C/W, VVDD = 20 V,
TJ = 150°C, TA = 25°C		 71
Safety Switch Current (Off State, 5 second) RθJA, EVM, 5S(3) = 30°C/W, VVDD = 0 V,
TJ = 150°C, TA = 25°C		 2.7
Safety Switch Current (Off State, 60 second) RθJA, EVM, 60S(3) = 52°C/W, VVDD = 0 V,
TJ = 150°C, TA = 25°C		 1.5
PS Safety input, output, or total power RθJA = 70°C/W,
TJ = 150°C, TA = 25°C.		 1.78 W
TS Maximum safety temperature 150 °C
(1) Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
(2) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
(3) Assuming PCB layout similar to EVM in Layout Guideline section.