SLVSFX8A March   2021  – March 2022 TPS2521

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
      1.      15
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Reverse Polarity Protection
      2. 8.3.2 Undervoltage Lockout (UVLO and UVP)
      3. 8.3.3 Overvoltage Clamp (OVC)
      4. 8.3.4 Inrush Current, Overcurrent, and Short Circuit Protection
        1. 8.3.4.1 Slew Rate (dVdt) and Inrush Current Control
        2. 8.3.4.2 Active Current Limiting
        3. 8.3.4.3 Short-Circuit Protection
      5. 8.3.5 Analog Load Current Monitor
      6. 8.3.6 Reverse Current Protection
      7. 8.3.7 Overtemperature Protection (OTP)
      8. 8.3.8 Fault Response
      9. 8.3.9 Power Good Indication (PG)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Single Device, Self-Controlled
    3. 9.3 Typical Application
      1. 9.3.1 Application
      2. 9.3.2 Design Requirements
      3. 9.3.3 Detailed Design Procedure
        1. 9.3.3.1 Device Selection
        2. 9.3.3.2 Setting Undervoltage and Overvoltage Thresholds
        3. 9.3.3.3 Setting Output Voltage Rise Time (tR)
        4. 9.3.3.4 Setting Power Good Assertion Threshold
        5. 9.3.3.5 Setting Overcurrent Threshold (ILIM)
        6. 9.3.3.6 Setting Overcurrent Blanking Interval (tITIMER)
      4. 9.3.4 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) TPS2521xx UNIT
RPW (QFN)
10 PINS
RθJA Junction-to-ambient thermal resistance 41.7 (2) °C/W
74.5 (3) °C/W
ΨJT Junction-to-top characterization parameter 1 °C/W
ΨJB Junction-to-board characterization parameter 20 (2) °C/W
27.6 (3) °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Based on simulations conducted with the device mounted on a custom 4-layer PCB (2s2p) with 8 thermal vias under device
(3) Based on simulations conducted with the device mounted on a JEDEC 4-layer PCB (2s2p) with no thermal vias under device