SLVSGI0C September   2022  – June 2024 DRV8411

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
  8. 7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 External Components
    4. 8.4 Feature Description
      1. 8.4.1 Bridge Control
        1. 8.4.1.1 Parallel Bridge Interface
      2. 8.4.2 Current Regulation
      3. 8.4.3 Protection Circuits
        1. 8.4.3.1 Overcurrent Protection (OCP)
        2. 8.4.3.2 Thermal Shutdown (TSD)
        3. 8.4.3.3 Undervoltage Lockout (UVLO)
    5. 8.5 Device Functional Modes
      1. 8.5.1 Active Mode
      2. 8.5.2 Low-Power Sleep Mode
      3. 8.5.3 Fault Mode
    6. 8.6 Pin Diagrams
      1. 8.6.1 Logic-Level Inputs
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Stepper Motor Application
          1. 9.1.1.1.1 Design Requirements
          2. 9.1.1.1.2 Detailed Design Procedure
            1. 9.1.1.1.2.1 Stepper Motor Speed
            2. 9.1.1.1.2.2 Current Regulation
            3. 9.1.1.1.2.3 Stepping Modes
              1. 9.1.1.1.2.3.1 Full-Stepping Operation
              2. 9.1.1.1.2.3.2 Half-Stepping Operation with Fast Decay
              3. 9.1.1.1.2.3.3 Half-Stepping Operation with Slow Decay
          3. 9.1.1.1.3 Application Curves
        2. 9.1.1.2 Dual BDC Motor Application
          1. 9.1.1.2.1 Design Requirements
          2. 9.1.1.2.2 Detailed Design Procedure
            1. 9.1.1.2.2.1 Motor Voltage
            2. 9.1.1.2.2.2 Current Regulation
            3. 9.1.1.2.2.3 Sense Resistor
          3. 9.1.1.2.3 Application Curves
        3. 9.1.1.3 Thermal Considerations
          1. 9.1.1.3.1 Maximum Output Current
          2. 9.1.1.3.2 Power Dissipation
          3. 9.1.1.3.3 Thermal Performance
            1. 9.1.1.3.3.1 Steady-State Thermal Performance
            2. 9.1.1.3.3.2 Transient Thermal Performance
        4. 9.1.1.4 Multi-Sourcing with Standard Motor Driver Pinout
    2. 9.2 Power Supply Recommendations
      1. 9.2.1 Bulk Capacitance
      2. 9.2.2 Power Supply and Logic Sequencing
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.1.1.4 Multi-Sourcing with Standard Motor Driver Pinout

The devices come in industry standard package footprints in the PWP and RTE packages.

As shown in Section 4, the DRV8410/11/11A devices are pin-to-pin compatible with the DRV8833 and DRV8833C. Many drivers from other suppliers have footprints similar to DRV8833 and DRV8833C.

  • When replacing a device similar to DRV8833, user should remove the capacitors for the internal regulator (VINT) and the charge pump (VCP) by setting them as DNP (do not place) in the design files.

  • The internal voltage reference for current regulation is 200 mV, just like the DRV8833 and DRV8833C. Because the voltage reference is the same, the system can still use the same xISEN resistor values designed for DRV8833 or other second source drivers with the same pinout.

  • DRV841xPWP can use the same footprint as DRV8833 and DRV8833C in the HTSSOP package as shown in Figure 9-21 and Figure 9-22.

  • DRV841xRTE are only footprint compatible with DRV8833C and other suppliers in the 3 mm x 3 mm QFN package.

DRV8411 DRV8833 Layout ExampleFigure 9-21 DRV8833 Layout Example
DRV8411 DRV8410/1 Footprint Compatible Layout ExampleFigure 9-22 DRV8410/1 Footprint Compatible Layout Example