SLVSGO0 October   2024 TPS25763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Components
    5. 6.5  Thermal Information
    6. 6.6  Buck-Boost Regulator
    7. 6.7  CC Cable Detection Parameters
    8. 6.8  CC VCONN Parameters
    9. 6.9  CC PHY Parameters
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Oscillator Characteristics
    12. 6.12 ADC Characteristics
    13. 6.13 TVSP Parameters
    14. 6.14 Input/Output (I/O) Characteristics
    15. 6.15 BC1.2 Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power Management and Supervisory Circuitry
        1. 8.3.1.1 VIN UVLO and Enable/UVLO
        2. 8.3.1.2 Internal LDO Regulators
      2. 8.3.2  TVSP Device Configuration and ESD Protection
      3. 8.3.3  External NFET and LSGD
      4. 8.3.4  Buck-Boost Regulator
        1. 8.3.4.1  Buck-Boost Regulator Operation
        2. 8.3.4.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 8.3.4.3  VIN Supply and VIN Over-Voltage Protection
        4. 8.3.4.4  Feedback Paths and Error Amplifiers
        5. 8.3.4.5  Transconductors and Compensation
        6. 8.3.4.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 8.3.4.7  VBUS Overvoltage Protection
        8. 8.3.4.8  VBUS Undervoltage Protection
        9. 8.3.4.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 8.3.4.10 Buck-Boost Peak Current Limits
      5. 8.3.5  USB-PD Physical Layer
        1. 8.3.5.1 USB-PD Encoding and Signaling
        2. 8.3.5.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.5.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.5.4 USB-PD BMC Transmitter
        5. 8.3.5.5 USB-PD BMC Receiver
        6. 8.3.5.6 Squelch Receiver
      6. 8.3.6  VCONN
      7. 8.3.7  Cable Plug and Orientation Detection
        1. 8.3.7.1 Configured as a Source
        2. 8.3.7.2 Configured as a Sink
        3. 8.3.7.3 Configured as a DRP
        4. 8.3.7.4 Overvoltage Protection (Px_CC1, Px_CC2)
      8. 8.3.8  ADC
        1. 8.3.8.1 ADC Divider Ratios
      9. 8.3.9  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      10. 8.3.10 DisplayPort Hot-Plug Detect (HPD)
      11. 8.3.11 USB2.0 Low-Speed Endpoint
      12. 8.3.12 Digital Interfaces
        1. 8.3.12.1 General GPIO
        2. 8.3.12.2 I2C Buffer
      13. 8.3.13 I2C Interface
        1. 8.3.13.1 I2C Interface Description
        2. 8.3.13.2 I2C Clock Stretching
        3. 8.3.13.3 I2C Address Setting
        4. 8.3.13.4 Unique Address Interface
        5. 8.3.13.5 I2C Pullup Resistor Calculation
      14. 8.3.14 Digital Core
        1. 8.3.14.1 Device Memory
        2. 8.3.14.2 Core Microprocessor
      15. 8.3.15 NTC Input
      16. 8.3.16 Thermal Sensors and Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application GUI Selections
        2. 9.2.2.2 EEPROM Selection
        3. 9.2.2.3 EN/UVLO
        4. 9.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 9.2.2.5 Inductor Currents
        6. 9.2.2.6 Output Capacitor
        7. 9.2.2.7 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     106

9.2.2.5 Inductor Currents

Table 9-1 lists recommended inductor values based on desired switching frequency, fSW. The following equations were used to derive the values in the Buck Calculation and Boost Calculation results tables below.

Equation 11. TPS25763-Q1
Equation 12. TPS25763-Q1

where

  • VIN(MAX) = maximum input voltage
  • VIN(MIN) = minimum input voltage
  • VOUT = output voltage
  • DBUCK = minimum duty cycle for buck mode
  • DBOOST = maximum duty cycle for boost mode
  • η = estimated efficiency calculated at VIN, VOUT, and IOUT

Buck Mode

Equation 13. TPS25763-Q1
Equation 14. TPS25763-Q1

where

  • VIN(MAX) = maximum input voltage
  • VOUT(MIN) = minimum output voltage
  • IOUT = maximum DC output current
  • ΔIL-BUCK(MAX) = maximum ripple current through the inductor when in buck operation
  • ISW_BUCK(MAX) = maximum switch current when in buck operation
  • DBUCK = minimum duty cycle for buck operation
  • fSW = switching frequency of the converter
  • L = selected inductor value
Equation 15. TPS25763-Q1

where

  • IMAXOUT(BUCK) = maximum deliverable current through inductor by the converter
  • IPEAK(BUCK) = buck switch peak current limit from Electrical Characteristics table
  • ΔIL_BUCK(MAX) = Ripple current through the inductor calculated in Equation 14.

Boost Mode

Equation 16. TPS25763-Q1
Equation 17. TPS25763-Q1

where

  • VIN(MIN) = minimum input voltage
  • VOUT(MAX) = desired output voltage
  • IOUT = desired output current
  • ΔIL_BOOST(MAX) = maximum ripple current through the inductor in boost operation
  • ISW_BOOST(MAX) = maximum switch current in boost operation
  • DBOOST = maximum duty cycle for boost operation
  • fSW= switching frequency of the converter
  • L = selected inductor value
Equation 18. TPS25763-Q1

where

  • IMAXOUT(BOOST) = maximum deliverable current through inductor by the converter
  • DBOOST = maximum duty cycle for boost mode
  • IPEAK(BOOST) = boost switch peak current limit from Electrical Characteristics table
  • ΔIL_MAX(BOOST) = Ripple current through the inductor calculated in Equation 17.

Buck Operation

Table 9-6 provides the tabulated ΔIL_BUCK(MAX) and ISW_BUCK(MAX) for the conditions below.

  • η = 0.95
  • VIN(MAX) = 18 V
  • VOUT(MIN) = 3.3 V
  • DBUCK(MIN) = 0.193

Table 9-6 Buck Calculation Results (L = 4.7 µH), IBUS = 3 A
fSW
(kHz)		 IOUT
(A)		 ΔIL_BUCK(MAX)
(A)		 ISW_BUCK(MAX)
(A)
300 3.00 2.87 4.44
400 3.00 2.15 4.08
450 3.00 1.91 3.96
300 3.00 2.01 4.01
400 3.00 1.51 3.76
450 3.00 1.34 3.67

Boost Operation

Table 9-6 provides the tabulated ΔIL_BOOST(MAX), ISW_BOOST(MAX), suggested GUI IPEAK(BOOST) (MIN) settings for the maximum output power conditions shown below.

If ISW_BOOST(MAX) > IPEAK(BOOST) (MIN) → VBUS dropout likely.

If ISW_BOOST(MAX) < IPEAK(BOOST) (MIN) → VBUS regulates normally.

  • η = 0.95
  • VIN(MIN) = 5.5 V to 9 V
  • VOUT(MAX) = 21 V
  • IOUT = 3 A

To be noted, the calculation here uses 21V 3 A instead of 20 V 3.25A because 21 V 3A has bigger inductor peak current.

Table 9-7 Boost Calculation Results (L = 4.7 µH), IBUS = 3 A
fSW
(kHz)		 VIN(MIN)
(V)		 DBOOST(MAX) ΔIL_BOOST(MAX)
(A)		 ISW_BOOST(MAX)
(A)		 GUI (1)
IPEAK(BOOST)
(A)
300 5.5 0.751 2.93 13.51 12.3
6 0.729 3.10 12.62 12.3
6.5 0.706 3.25 11.83 12.3
7 0.683 3.39 11.16 12.3
7.5 0.661 3.52 10.61 10.8
8 0.638 3.62 10.10 10.8
8.5 0.615 3.71 9.65 10.8
9 0.593 3.79 9.27 9.3
400 5.5 0.751 2.20 13.15 12.3
6 0.729 2.33 12.24 12.3
6.5 0.706 2.44 11.42 12.3
7 0.683 2.54 10.73 10.8
7.5 0.661 2.64 10.17 10.8
8 0.638 2.71 9.64 10.8
8.5 0.615 2.78 9.18 9.3
9 0.593 2.84 8.79 9.3
450 5.5 0.751 1.95 13.02 12.3
6 0.729 2.07 12.11 12.3
6.5 0.706 2.17 11.29 12.3
7 0.683 2.26 10.59 10.8
7.5 0.661 2.34 10.02 10.8
8 0.638 2.41 9.49 9.3
8.5 0.615 2.47 9.03 9.3
9 0.593 2.51 8.63 9.3
(1) MIN value of boost peak ILIM shown. See electrical characteristics table for MIN, TYP, MAX values.