SLVSGT9B February   2023  – June 2024 TPS25948

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 7.3.2 Overvoltage Lockout (OVLO)
      3. 7.3.3 Inrush Current, Overcurrent, and Short Circuit Protection
        1. 7.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 7.3.3.2 Active Current Limiting
        3. 7.3.3.3 Short-Circuit Protection
      4. 7.3.4 Analog Load Current Monitor
      5. 7.3.5 Reverse Current Protection
      6. 7.3.6 Overtemperature Protection (OTP)
      7. 7.3.7 Fault Response and Indication (FLT)
      8. 7.3.8 Supply Good Indication (SPLYGD/SPLYGD)
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Single Device, Self-Controlled
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Setting Overvoltage Threshold
        2. 8.3.2.2 Setting Output Voltage Rise Time (tR)
        3. 8.3.2.3 Setting Overcurrent Threshold (ILIM)
        4. 8.3.2.4 Setting Overcurrent Blanking Interval (tITIMER)
      3. 8.3.3 Application Curves
    4. 8.4 Active ORing
    5. 8.5 Priority Power MUXing
    6. 8.6 Parallel Operation
    7. 8.7 USB PD Port Protection
    8. 8.8 Power Supply Recommendations
      1. 8.8.1 Transient Protection
      2. 8.8.2 Output Short-Circuit Measurements
    9. 8.9 Layout
      1. 8.9.1 Layout Guidelines
      2. 8.9.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.6 Overtemperature Protection (OTP)

The TPS25948xx monitors the internal die temperature (TJ) at all times and shuts down the part as soon as the temperature exceeds a safe operating level (TSD) thereby protecting the device from damage. The device will not turn back on until the junction cools down sufficiently, that is the die temperature falls below (TSD – TSDHYS).

When the TPS25948xL (latch-off variant) detects thermal overload, it will be shut down and remain latched-off until the device is power cycled or re-enabled. When the TPS25948xA (auto-retry variant) detects thermal overload, it will remain off until it has cooled down by TSDHYS. Thereafter, it will remain off for an additional delay of tRST after which it will automatically retry to turn on if it is still enabled.

Table 7-1 Thermal Shutdown
DeviceEnter TSDExit TSD
TPS25948xL (Latch-Off)TJ ≥ TSDTJ < TSD – TSDHYS

VIN cycled to 0 V and then above VUVP(R) OR EN/UVLO toggled below VSD(F)

TPS25948xA (Auto-Retry)TJ ≥ TSDTJ < TSD – TSDHYS

VIN cycled to 0 V and then above VUVP(R) OR EN/UVLO toggled below VSD(F) OR tRST timer expired