SLVSH09A November   2023  – June 2024 TPS6522005-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  System Control Thresholds
    6. 5.6  BUCK1 Converter
    7. 5.7  BUCK2, BUCK3 Converter
    8. 5.8  General Purpose LDOs (LDO1, LDO2)
    9. 5.9  General Purpose LDOs (LDO3, LDO4)
    10. 5.10 GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
    11. 5.11 Voltage and Temperature Monitors
    12. 5.12 I2C Interface
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power-Up Sequencing
      2. 6.3.2  Power-Down Sequencing
      3. 6.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 6.3.4  Reset to SoC (nRSTOUT)
      5. 6.3.5  Buck Converters (Buck1, Buck2, and Buck3)
        1. 6.3.5.1 Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Linear Regulators (LDO1 through LDO4)
      7. 6.3.7  Interrupt Pin (nINT)
      8. 6.3.8  PWM/PFM and Low Power Modes (MODE/STBY)
      9. 6.3.9  PWM/PFM and Reset (MODE/RESET)
      10. 6.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)
      11. 6.3.11 General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
      12. 6.3.12 I2C-Compatible Interface
        1. 6.3.12.1 Data Validity
        2. 6.3.12.2 Start and Stop Conditions
        3. 6.3.12.3 Transferring Data
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
        1. 6.4.1.1 OFF State
        2. 6.4.1.2 INITIALIZE State
        3. 6.4.1.3 ACTIVE State
        4. 6.4.1.4 STBY State
        5. 6.4.1.5 Fault Handling
    5. 6.5 Multi-PMIC Operation
    6. 6.6 NVM Programming
      1. 6.6.1 TPS6522005-EP default NVM settings
      2. 6.6.2 NVM programming in Initialize State
      3. 6.6.3 NVM Programming in Active State
    7. 6.7 User Registers
    8. 6.8 Device Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Example
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Buck1, Buck2, Buck3 Design Procedure
        2. 7.2.3.2 LDO1, LDO2 Design Procedure
        3. 7.2.3.3 LDO3, LDO4 Design Procedure
        4. 7.2.3.4 VSYS, VDD1P8
        5. 7.2.3.5 Digital Signals Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.2.3.2 LDO1, LDO2 Design Procedure

Input Capacitance - LDO1, LDO2

LDO inputs require an input decoupling capacitor to minimize input ripple voltage. Using a typical of 2.2-µF capacitance for each LDO is recommended. Depending on the input voltage of the LDO, a 6.3 V or higher rated capacitor can be used. The same input capacitance requirements applies when the LDO is configured as LDO, bypass or "load-switch.

Output Capacitance - LDO1, LDO2

LDO outputs require an output capacitor to hold up the output voltage during a load step or changes to the input voltage. Using a 2.2-µF local capacitance for each LDO output with ESR of 10 mΩ or less is recommended. Local capacitance must not exceed 4uF (after derating). This requirement excludes any capacitance seen at the load and only refers to the capacitance seen close to the device. The total capacitance (local + point of load) that each LDO can support depends on the NVM configuration. Table 7-3 shows the maximum total output capacitance allowed based on the rail configuration. Refer to the Technical Reference Manual (TRM) for the specific orderable part number to identify the LDO configuration based on the register settings and the applicable max total capacitance.

Table 7-2 LDO1, LDO2 output capacitance
Register setting LDO config Max total capacitance (2.2uF local + point of load)
LDOx_LSW_CONFIG LDOx_BYP_CONFIG
0 0 LDO 20uF
0 1 Bypass 50uF
1 X Load-switch 50uF