SLVSHL9 November   2024 TPS922051

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adaptive Off-Time Current Mode Control
      2. 7.3.2 Setting LED Current
      3. 7.3.3 Internal Soft Start
      4. 7.3.4 Dimming Mode
        1. 7.3.4.1 PWM Dimming
        2. 7.3.4.2 Analog Dimming
      5. 7.3.5 Fault Protection
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 TPS922051D2 24V Input, 2A Output, 4-piece WLED Driver With Analog Dimming
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
          4. 8.2.1.2.4 Sense Resistor Selection
          5. 8.2.1.2.5 Other External Components Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TPS922050D1 48V Input, 1A Output, 12-piece WLED Driver with PWM Dimming
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Inductor Selection
          2. 8.2.2.2.2 Input Capacitor Selection
          3. 8.2.2.2.3 Output Capacitor Selection
          4. 8.2.2.2.4 Sense Resistor Selection
          5. 8.2.2.2.5 Other External Components Selection
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

11.1 Package Option Addendum

Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish(4) MSL Peak Temp (3) Op Temp (°C) Device Marking(5)(6)
TPS922051D1DSGR ACTIVE WSON DSG 8 3000 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2211
TPS922051D2DSGR ACTIVE WSON DSG 8 3000 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2212
TPS922051D1DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2211
TPS922051D2DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2212
TPS922050D1DSGR ACTIVE WSON DSG 8 3000 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2201
TPS922050D2DSGR ACTIVE WSON DSG 8 3000 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2202
TPS922050D1DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2201
TPS922050D2DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2202
TPS922050D1DRLR ACTIVE SOT583 DRL 8 4000 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2201
TPS922050D2DRLR ACTIVE SOT583 DRL 8 4000 Green (RoHS and no Sb/Br) Cu NiPdAu

LEVEL1-260C-UNLIM

 -40 to 85 2202
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.