SLVSI94 November   2024 ESD501-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - AEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 ESD Ratings - ISO Specifications
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Thermal Information
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

5.6 Thermal Information

THERMAL METRIC(1) ESD501-Q1 UNIT
DPY (DFN1006)
2 PINS
RθJA Junction-to-ambient thermal resistance 284.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 153.9 °C/W
RθJB Junction-to-board thermal resistance 100.5 °C/W
ΨJT Junction-to-top characterization parameter 9.4 °C/W
ΨJB Junction-to-board characterization parameter 99.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.