SLVU735A June   2012  – February 2022 TPS51225

 

  1.   Trademarks
  2. 1 Description
    1. 1.1 Typical Applications
    2. 1.2 Features
  3. 2 Electrical Performance Specifications
  4. 3 Schematic
  5. 4 Test Setup
    1. 4.1 Test Equipment
    2. 4.2 Recommended Test Setup
  6. 5 Configurations
  7. 6 Test Procedure
    1. 6.1 Line/Load Regulation and Efficiency Measurement Procedure
    2. 6.2 List of Test Points
    3. 6.3 Equipment Shutdown
  8. 7 Performance Data and Typical Characteristic Curves
    1. 7.1  5-V Efficiency
    2. 7.2  5-V Load Regulation
    3. 7.3  3.3-V Efficiency
    4. 7.4  3.3-V Load Regulation
    5. 7.5  Enable Turn-On/Turn-Off
    6. 7.6  Output Ripple
    7. 7.7  Switching Node
    8. 7.8  5-V Output Transient with Auto-skip Mode
    9. 7.9  3.3-V Output Transient with Auto-skip Mode
    10. 7.10 Output Prebias Turn-On
    11. 7.11 Thermal Image
  9. 8 EVM Assembly Drawing and PCB Layout
  10. 9 Bill of Materials
  11. 10Revision History

8 EVM Assembly Drawing and PCB Layout

The following figures (Figure 8-1 through Figure 8-6) show the design of the TPS51225EVM-133 printed circuit board. The EVM has been designed using four layers, 2-oz copper circuit board.

GUID-A289140D-551A-4036-AD03-C2D0B2E7DFFE-low.gifFigure 8-1 TPS51225EVM-133 Top Layer Assembly Drawing
GUID-0A47515F-4E27-426B-B1DF-A4C68AA7BA36-low.gifFigure 8-2 TPS51225EVM-133 Bottom Assembly Drawing
GUID-3062E912-3331-4A41-A07F-29FDC2091485-low.gifFigure 8-3 TPS51225EVM-133 Top Copper
GUID-1AE43AFF-7992-4CFD-A56C-75503A380066-low.gifFigure 8-4 TPS51225EVM-133 Layer 2 Copper
GUID-6DD7CD8D-F7A8-474B-AD3E-812511BF1A96-low.gifFigure 8-5 TPS51225EVM-133 Layer 3 Copper
GUID-2AD5F7BE-CC6C-4657-91C3-D9D8F493241C-low.gifFigure 8-6 TPS51225EVM-133 Layer 4 Copper