SLVUC37 March   2021 TPS25814

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Description
    2. 1.2 Features
    3. 1.3 Applications
  3. 2EVM Setup
  4. 3EVM Connectors, Test Points, and Devices
    1. 3.1 Power: 5 V and 3.3 V Supply
    2. 3.2 Power: 1.8 V Supply
    3. 3.3 Power: Barrel Jack Power Connector
    4. 3.4 Switches: ADCIN1 and ADCIN2
    5. 3.5 Switches: CTL, CHG_HI, EN
    6. 3.6 USB Type-C Connector: DFP and UFP
    7. 3.7 Device: TPS25814
    8. 3.8 Device: HD3SS3220
    9. 3.9 Device: TUSB542
  5. 4Testing Procedures
  6. 5PCB Layouts
  7. 6Schematics
  8. 7Bill of Materials

PCB Layouts

GUID-20210318-CA0I-S0HV-7ZGG-TBHTTF4QKBXR-low.pngFigure 5-1 Top Overlay
GUID-20210318-CA0I-Z1WT-SLVT-SRV6ZXRXBBPB-low.pngFigure 5-3 Top Layer
GUID-20210318-CA0I-03QL-LXMP-B1J2C1CLLZP1-low.pngFigure 5-5 High Speed Layer
GUID-20210318-CA0I-2WPH-CMKR-3R5RVBVWTFDF-low.pngFigure 5-7 Power 1 Layer
GUID-20210318-CA0I-3BXC-WCCK-RJC6QNB4PTP1-low.pngFigure 5-9 GND 3 Layer
GUID-20210318-CA0I-MQC9-1SPG-K260QSNFBVPX-low.pngFigure 5-11 Bottom Solder
GUID-20210318-CA0I-G04Z-QZDF-8RGF2F3DGG7F-low.pngFigure 5-2 Top Solder
GUID-20210318-CA0I-Z1WG-MDCF-WWP9JL30KK6S-low.pngFigure 5-4 GND 1 Layer
GUID-20210318-CA0I-WJZ5-0BMZ-DBJ7XBBHLQ0G-low.pngFigure 5-6 GND 2 Layer
GUID-20210318-CA0I-M0XB-N9QB-CLDRFRVZQGWG-low.pngFigure 5-8 Power 2 Layer
GUID-20210318-CA0I-KHKQ-TDRP-KZVG5HQT13BV-low.pngFigure 5-10 Bottom Layer
GUID-20210318-CA0I-6CQX-9PVQ-JV9BF4ZX01C7-low.pngFigure 5-12 Bottom Overlay