SLVUC93 September   2021 TPSM63606

 

  1.   Trademarks
  2. 1High-Density EVM Description
    1. 1.1 Typical Applications
    2. 1.2 Features and Electrical Performance
  3. 2EVM Performance Specifications
  4. 3EVM Photo
  5. 4Test Setup and Procedure
    1. 4.1 EVM Connections
    2. 4.2 EVM Setup
    3. 4.3 Test Equipment
    4. 4.4 Recommended Test Setup
      1. 4.4.1 Input Connections
      2. 4.4.2 Output Connections
    5. 4.5 Test Procedure
      1. 4.5.1 Line/Load Regulation and Efficiency
  6. 5Test Data and Performance Curves
    1. 5.1 Efficiency and Load Regulation Performance
    2. 5.2 Waveforms
    3. 5.3 Bode Plot
    4. 5.4 Thermal Performance
    5. 5.5 EMI Performance
  7. 6EVM Documentation
    1. 6.1 Schematic
    2. 6.2 Bill of Materials
    3. 6.3 PCB Layout
    4. 6.4 Assembly Drawings
    5. 6.5 Multi-Layer Stackup
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Custom Design With WEBENCH® Tools
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation

6.3 PCB Layout

Figure 6-2 through Figure 6-7 show the PCB layout images, including 3D views, copper layers, assembly drawings, and layer stackup diagram. The PCB is 62-mils standard thickness with 2-oz copper on all layers.

Figure 6-2 3D Top View
Figure 6-3 3D Bottom View
Figure 6-4 Top Layer Copper
Figure 6-5 Layer 2 Copper
Figure 6-6 Layer 3 Copper
Figure 6-7 Bottom Layer Copper (Viewed From Top)