SLVUCF0A june   2022  – may 2023

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Background
  5. 2Quick Start
  6. 3EVM Connections
  7. 4Schematic
  8. 5PCB Layout
  9. 6Test Data and Performance Curves
    1. 6.1 Efficiency and Load Regulation Performance
    2. 6.2 Waveforms
    3. 6.3 Thermal Performance
    4. 6.4 EMI Performance
  10. 7Bill of Materials
  11. 8Custom Design With WEBENCH® Tools
  12. 9Revision History

PCB Layout

Figure 5-1 through Figure 5-6 show the PCB layout images, including 3D views and copper layers. The PCB is 62 mils standard thickness with 2-oz copper on all four layers as shown in Table 5-1. The PCB is also optimized for EMI performance. The layout minimizes the area of high dv/dt nodes like SW and BOOT with the addition of a snubber circuit to attenuate SW node ringing. The small high-frequency ceramic input capacitors are placed very close to the IC to minimize the loop formed from VIN pins, through the capacitor, to the PGND pins. The board also features an EMI filter on the back-side of the board with options for an inductor, ferrite bead, and filter capacitors to tune the filter's EMI performance.

GUID-20230504-SS0I-Z6MD-PHQ9-C4WL9TP6RVTN-low.svg Figure 5-1 3D Top View
GUID-20230502-SS0I-ZC0S-SXLL-WLPJCRSR9WPS-low.svg Figure 5-2 3D Bottom View
GUID-20230404-SS0I-F1X6-LW5Z-Z8XMNX9B16RQ-low.svg Figure 5-3 Top Layer Copper
GUID-20230502-SS0I-W6RP-5RDQ-4DWL0FZTWMGC-low.svg Figure 5-4 Layer 2 Copper
GUID-20230404-SS0I-PD8Q-XV76-W81HDK6LRD4V-low.svg Figure 5-5 Layer 3 Copper
GUID-20230404-SS0I-J4F0-QDNX-FKFFB1X7CRTH-low.svg Figure 5-6 Bottom Layer Copper (Top View)
Table 5-1 Multi-Layer Stackup
No. Name Material Type Weight (oz) Thickness (mil) Dielectric Const.
Top Overlay Overlay
Top Solder Solder Resist Solder Mask 0.4 3.5
1 Top Layer Copper Signal 2 2.8
Dielectric 1 FR-4 High Tg Dielectric Prepreg 6 4.2
2 Signal Layer 1 Copper Signal 2 2.8
Dielectric 2 FR-4 High Tg Dielectric Core 38 4.2
3 Signal Layer 2 Copper Signal 2 2.8
Dielectric 3 FR-4 High Tg Dielectric Prepreg 6 4.2
4 Bottom Layer Copper Signal 2 2.8
Bottom Solder Solder Resist Solder Mask 0.4 3.5
Bottom Overlay Overlay