SLVUCF0A june 2022 – may 2023
Figure 5-1 through Figure 5-6 show the PCB layout images, including 3D views and copper layers. The PCB is 62 mils standard thickness with 2-oz copper on all four layers as shown in Table 5-1. The PCB is also optimized for EMI performance. The layout minimizes the area of high dv/dt nodes like SW and BOOT with the addition of a snubber circuit to attenuate SW node ringing. The small high-frequency ceramic input capacitors are placed very close to the IC to minimize the loop formed from VIN pins, through the capacitor, to the PGND pins. The board also features an EMI filter on the back-side of the board with options for an inductor, ferrite bead, and filter capacitors to tune the filter's EMI performance.
No. | Name | Material | Type | Weight (oz) | Thickness (mil) | Dielectric Const. |
---|---|---|---|---|---|---|
Top Overlay | Overlay | |||||
Top Solder | Solder Resist | Solder Mask | 0.4 | 3.5 | ||
1 | Top Layer | Copper | Signal | 2 | 2.8 | |
Dielectric 1 | FR-4 High Tg | Dielectric Prepreg | 6 | 4.2 | ||
2 | Signal Layer 1 | Copper | Signal | 2 | 2.8 | |
Dielectric 2 | FR-4 High Tg | Dielectric Core | 38 | 4.2 | ||
3 | Signal Layer 2 | Copper | Signal | 2 | 2.8 | |
Dielectric 3 | FR-4 High Tg | Dielectric Prepreg | 6 | 4.2 | ||
4 | Bottom Layer | Copper | Signal | 2 | 2.8 | |
Bottom Solder | Solder Resist | Solder Mask | 0.4 | 3.5 | ||
Bottom Overlay | Overlay |