SLVUCI3 June   2022

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2BoosterPack™ Plug-in Module Operation
  5. 3TPS1HC30EVM Schematic
  6. 4Connection Descriptions
  7. 5Current Limit and Current Sense Configuration
  8. 6Transient Protection
  9. 7TPS1HC30EVM Assembly Drawings and Layout
  10. 8Bill Of Materials
  11. 9Appendix - TPL0102-100 Resistance Codes

Trademarks

BoosterPack™ and LaunchPad™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.