SLVUCN1 January   2023 TLVM13610

 

  1.   Abstract
  2.   Trademarks
  3. 1High-Density EVM Description
    1. 1.1 Typical Applications
  4. 2Test Setup and Procedure
    1. 2.1 EVM Connections
    2. 2.2 EVM Setup
    3. 2.3 Test Equipment
    4. 2.4 Recommended Test Setup
      1. 2.4.1 Input Connections
      2. 2.4.2 Output Connections
    5. 2.5 Test Procedure
      1. 2.5.1 Line, Load Regulation and Efficiency
  5. 3Test Data and Performance Curves
    1. 3.1 Efficiency and Load Regulation Performance
    2. 3.2 Waveforms
    3. 3.3 Bode Plot
    4. 3.4 EMI Performance
  6. 4EVM Documentation
    1. 4.1 Schematic
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout
    4. 4.4 Multi-Layer Stackup
  7. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Development Support
        1. 5.1.1.1 Custom Design With WEBENCH® Tools
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation

4.4 Multi-Layer Stackup

Figure 4-8 Layer Stackup