SLVUCN9 September   2023 TPSM365R15

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Setup Procedure
  6. 3Test Setup
  7. 4Schematic
  8. 5TPSM365R15EVM and TPSM365R15FEVM Evaluation
  9. 6Layout
  10. 7Bill of Materials
  11. 8Reference

Layout

The top silkscreen (that is, J4) differs between the TPSM365R15EVM and TPSM365R15FEVM, which is the only difference between the layer plots (no routing).

GUID-20230310-SS0I-Z8RQ-CDK8-DCTWCZMGNQDL-low.png Figure 6-1 PCB Top 2-D (TPSM365R15EVM)
GUID-20230310-SS0I-PJVT-SXWQ-MHBGNG6MCMV8-low.png Figure 6-2 PCB Top 2-D (TPSM365R15FEVM)
GUID-E80704A2-BF76-4275-B3ED-FE83CAC7BE9B-low.pngFigure 6-3 PCB Bottom 2-D
GUID-20230310-SS0I-ZRQG-GBJ9-BVTFDHXC0MZX-low.png Figure 6-4 Top Layer

Reserved for solid ground plane for low-noise and optimized thermal design.

GUID-20230310-SS0I-BWLL-DJF9-MJNPXVTQHPR3-low.png Figure 6-5 Mid Layer 1

Primary routing layer

GUID-20230310-SS0I-JZMH-07WH-HRQFVWMD8C2G-low.png Figure 6-6 Mid Layer 2

Reserved for PI filter and non-critical passive component placement (minus input capacitor). An input capacitor is placed on the bottom side of the PCB as this placement provides a slightly lower input loop inductance. A single layer implementation is satisfactory as well.

GUID-20230310-SS0I-NF90-MTMB-BLQCNRVDXJ2W-low.png Figure 6-7 Bottom Layer