SLVUCX4 October   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 EVM Connections
    2. 2.2 Test Equipment
    3. 2.3 EVM Setup
      1. 2.3.1 Input Connections
      2. 2.3.2 Output Connections
      3. 2.3.3 Heat Sink Setup
  8. 3Implementation Results
    1. 3.1 Test Data and Performance Curves
      1. 3.1.1 Efficiency and Load Regulation Performance
      2. 3.1.2 Waveforms and Plots
      3. 3.1.3 EMI Performance
      4. 3.1.4 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
        1. 6.1.1.1 Custom Design With WEBENCH® Tools
    2. 6.2 Documentation Support
      1. 6.2.1 Related Documentation

4.2 PCB Layout

The PCB is 62-mils standard thickness with 2-oz copper on all layers.

LM644A2QEVM-S2100T Top Component ViewFigure 4-3 Top Component View
LM644A2QEVM-S2100T Bottom Component ViewFigure 4-4 Bottom Component View
LM644A2QEVM-S2100T Top Layer CopperFigure 4-5 Top Layer Copper
LM644A2QEVM-S2100T Layer 2 CopperFigure 4-6 Layer 2 Copper
LM644A2QEVM-S2100T Layer 3 CopperFigure 4-7 Layer 3 Copper
LM644A2QEVM-S2100T Layer 4 CopperFigure 4-8 Layer 4 Copper
LM644A2QEVM-S2100T Layer 5 CopperFigure 4-9 Layer 5 Copper
LM644A2QEVM-S2100T Bottom Layer Copper (Viewed From Top)Figure 4-10 Bottom Layer Copper (Viewed From Top)