SLVUCX4
October 2024
1
Description
Features
Applications
5
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
EVM Connections
2.2
Test Equipment
2.3
EVM Setup
2.3.1
Input Connections
2.3.2
Output Connections
2.3.3
Heat Sink Setup
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency and Load Regulation Performance
3.1.2
Waveforms and Plots
3.1.3
EMI Performance
3.1.4
Thermal Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.3
Bill of Materials
5
Additional Information
5.1
Trademarks
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.1.1.1
Custom Design With WEBENCH® Tools
6.2
Documentation Support
6.2.1
Related Documentation
6.1.1
Development Support
For development support see the following:
For TI's reference design library, visit
TI Designs
.
For TI's WEBENCH Design Environment, visit the
WEBENCH®
Design Center
.
To design a low-EMI power supply, review TI's comprehensive
EMI Training Series
.
Technical Articles:
How Device-level Features And Package Options Can Help Minimize EMI In Automotive Designs
Optimizing Flip-chip IC Thermal Performance In Automotive Designs