SLVUCY3 October   2024 LM65680-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line, Load Regulation, and Efficiency
  8. 3Implementation Results
    1. 3.1 Performance Data and Results
      1. 3.1.1 EVM Characteristics
      2. 3.1.2 Conversion Efficiency
      3. 3.1.3 Operating Waveforms
        1. 3.1.3.1 Switching
        2. 3.1.3.2 Load Transient Response
        3. 3.1.3.3 Short-Circuit Recovery
        4. 3.1.3.4 Start-Up and Shutdown With EN
        5. 3.1.3.5 Start-Up With VIN
      4. 3.1.4 Bode Plot
      5. 3.1.5 CISPR 25 EMI Performance
      6. 3.1.6 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 Component Drawings
      2. 4.2.2 Multi-Layer Stackup
    3. 4.3 Bill of Materials
  10. 5Compliance Information
    1. 5.1 Compliance and Certifications
  11. 6Related Documentation
    1. 6.1 Supplemental Content
      1. 6.1.1 Development Support
      2. 6.1.2 PCB Layout Resources
      3. 6.1.3 Thermal Design Resources
  12. 7Additional Information
    1. 7.1 Trademarks

3.1 Performance Data and Results

The typical performance curves for the LM65680-Q1EVM are shown in Figure 3-1 through Figure 3-15. Because actual performance data can be affected by measurement techniques and environmental variables, these curves are presented for reference and can differ from actual field measurements.