SLYT793A may   2020  – may 2020 LM61460-Q1

1.   1
2. 1 Introduction
3. 2 Managing Thermals with Flip-chip Packages
4. 3 Board Construction Influence
5. 4 Copper Area and Thermals
6. 5 Estimating a Converter’s Junction Temperature
7. 6 Challenges with Measuring Converter Junction Temperature
8. 7 Further Thermal Optimization at the IC Level
9. 8 Conclusion
10. 9 References
11. 10Related Web Sites
    1. 10.1 General Information:
    2. 10.2 Product Information: