SLYT793A
may 2020 – may 2020
LM61460-Q1
1
1
Introduction
2
Managing Thermals with Flip-chip Packages
3
Board Construction Influence
4
Copper Area and Thermals
5
Estimating a Converter’s Junction Temperature
6
Challenges with Measuring Converter Junction Temperature
7
Further Thermal Optimization at the IC Level
8
Conclusion
9
References
10
Related Web Sites
10.1
General Information:
10.2
Product Information:
9
References
Anthony Fagnani, “Optimizing the Layout for the TPS54424/TPS54824 HotRod™ QFN Package for Thermal Performance,” Texas Instruments application report (SNVA839), November 2018.
John Tucker, “Thermal Performance of SWIFT™ DC/DC Converters in the 28-Pin HTSSOP Package,” Texas Instruments application report (SLVA201), February 2005.
Robert Kollman, “Power Tip: Don’t get burned by inductor core losses,” EE Times article, July 13, 2009.
Richard Nowakowski and Brian King, “Choosing the optimum switching frequency of your DC/DC converter,” EE Times, Oct. 25, 2006.
Marshall Beck, “EMI filter components and their nonidealities for automotive DC/DC regulators,” Analog Design Journal (SLYT782), December 2019.