| 1 Introduction | This white paper explores industry-standard package types and recent
innovations in analog semiconductor chip and module packaging technology,
ranging from power-management devices to operational amplifiers and data
converters, as well as other analog integrated circuits (ICs). |
| 2 How package variations meet market demands | Understanding the market requirements for reliability, cost-efficiency and
supply-chain resilience necessitates a focus on efficient and dependable
packaging. |
| 3 Power efficiency | Examining integration at the system, subsystem (board level) and package
level (including multiple dies and passive components) illustrates how
packaging technology can enhance power efficiency and density. |
| 4 Enabling miniature products | Exploring expected advancements in analog packaging technologies and their
potential impact. |