SNAK022 May   2024 LMX1860-SEP

 

  1.   1
  2.   LMX1860-SEP Single-Event Effects Test Report
  3.   Trademarks
  4. 1Product Description
  5. 2Test Setup
    1. 2.1 SEL Test
    2. 2.2 SEFI Test
    3. 2.3 Test Facility
  6. 3Results
    1. 3.1 SEL Results
    2. 3.2 SEFI Results
  7. 4Summary
  8. 5References

SEL Test

The DUT was heated to a junction temperature of 125°C using a heat gun supplied by LBNL. Prior to the ion runs, the on die temperature diode was monitored through the SPI and the heat gun was adjusted until a temperature readout of 125°C was achieved. The DUT board temperature was monitored during the ion runs using a thermistor epoxied to the DUT that was correlated to the temperature diode of the DUT.

The supply current to the DUT was monitored in real time. A current jump of greater than 1mA will be investigated.