SNAS734F
July 2017 – January 2024
CDCI6214
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
EEPROM Characteristics
6.6
Reference Input, Single-Ended and Differential Mode Characteristics (REFP, REFN, FB_P, FB_N)
6.7
Reference Input, Crystal Mode Characteristics (XIN, XOUT)
6.8
General-Purpose Input and Output Characteristics (GPIO[4:1], SYNC/RESETN)
6.9
Triple Level Input Characteristics (EEPROMSEL, REFSEL)
6.10
Reference Mux Characteristics
6.11
Phase-Locked Loop Characteristics
6.12
Closed-Loop Output Jitter Characteristics
6.13
Output Mux Characteristics
6.14
LVCMOS Output Characteristics
6.15
HCSL Output Characteristics
6.16
LVDS DC-Coupled Output Characteristics
6.17
Programmable Differential AC-Coupled Output Characteristics
6.18
Output Skew and Delay Characteristics
6.19
Output Synchronization Characteristics
6.20
Timing Characteristics
6.21
I2C-Compatible Serial Interface Characteristics (SDA/GPIO2, SCL/GPIO3)
6.22
Timing Requirements, I2C-Compatible Serial Interface (SDA/GPIO2, SCL/GPIO3)
6.23
Power Supply Characteristics
6.24
Typical Characteristics
7
Parameter Measurement Information
7.1
Parameters
7.1.1
Reference Inputs
7.1.2
Outputs
7.1.3
Serial Interface
7.1.4
Power Supply
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Reference Block
8.3.1.1
Input Stages
8.3.1.1.1
Crystal Oscillator
8.3.1.1.2
LVCMOS
8.3.1.1.3
Differential AC-Coupled
8.3.1.2
Reference Mux
8.3.1.3
Reference Divider
8.3.1.3.1
Doubler
8.3.1.4
Bypass-Mux
8.3.1.5
Zero Delay, Internal and External Path
8.3.2
Phase-Locked Loop
8.3.3
Clock Distribution
8.3.3.1
Output Channel
8.3.3.2
Divider Glitch-Less Update
8.3.4
Control Pins
8.3.4.1
Global and Individual Output Enable: OE and OE_Y[4:1]
8.3.5
Operation Modes
8.3.6
Divider Synchronization - SYNC
8.3.7
EEPROM - Cyclic Redundancy Check
8.3.8
Power Supplies
8.3.8.1
Power Management
8.4
Device Functional Modes
8.4.1
Pin Mode
8.4.2
Serial Interface Mode
8.4.2.1
Fall-Back Mode
8.5
Programming
8.5.1
Recommended Programming Procedure
8.5.2
EEPROM Access
8.5.3
Device Defaults
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
9.3
Do's and Don'ts
9.4
Initialization Setup
9.5
Power Supply Recommendations
9.5.1
Power-Up Sequence
9.5.2
De-Coupling
9.6
Layout
9.6.1
Layout Guidelines
9.6.2
Layout Examples
10
Register Maps
10.1
CDCI6214 Registers
10.2
EEPROM Map
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.2
Device Nomenclature
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
1
Features
One configurable high performance, low-power PLL with four programmable outputs
RMS jitter performance
Supports PCIe Gen1/ Gen2 / Gen3 / Gen4 without SSC
Typical power consumption: 150mW at 1.8V
(2)
Universal clock input
Differential AC-coupled or LVCMOS: 1MHz to 250MHz
Crystal: 8MHz to 50MHz
Flexible output frequencies
44.1kHz to 350MHz
Glitchless output divider switching
Four individually configurable outputs
LVCMOS,
LVDS or HCSL
Differential AC-coupled with programmable swing (LVDS-, CML-, LVPECL-compatible)
Fully integrated PLL, configurable loop bandwidth:
100kHz to 3MHz
Single or mixed supply operation for level translation: 1.8V, 2.5V and 3.3V
Configurable GPIOs
Status signals
Up to four individual output enables
Output divider synchronization
Flexible configuration options
I
2
C-compatible interface: up to 400kHz
Integrated EEPROM with two pages and external select pin
Only supports 100Ω systems
Industrial temperature range:
–40°C
to 85°C
Small footprint: 24-pin VQFN (4mm × 4mm)