SNAS826E
April 2022 – April 2024
LMK6C
,
LMK6D
,
LMK6H
,
LMK6P
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Ordering Information
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Environmental Compliance
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Thermal Information
6.7
Electrical Characteristics
6.8
Timing Diagrams
6.9
Typical Characteristics
7
Parameter Measurement Information
7.1
Device Output Configurations
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Bulk Acoustic Wave (BAW)
8.3.2
Device Block-Level Description
8.3.3
Function Pins
8.3.4
Clock Output Interfacing and Termination
8.3.5
Temperature Stability
8.3.6
Mechanical Robustness
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Providing Thermal Reliability
9.4.1.2
Recommended Solder Reflow Profile
9.4.2
Layout
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
6.9
Typical Characteristics
Figure 6-3
Current Consumption vs Frequency
(LVCMOS, 1.8V)
Figure 6-5
Current Consumption vs Frequency
(LVCMOS, 3.3V)
Figure 6-7
Current Consumption vs Frequency
(HCSL, 2.5V)
Figure 6-9
Current Consumption vs Frequency
(LVPECL, 1.8V)
Figure 6-11
Current Consumption vs Frequency
(LVPECL, 3.3V)
Figure 6-13
Current Consumption vs Frequency
(LVDS, 2.5V)
Figure 6-15
RMS Jitter vs Frequency (100MHz to 200MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-17
RMS Jitter vs Frequency (200MHz to 300MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-19
RMS Jitter vs Frequency (300MHz to 400MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-21
RMS Jitter vs Frequency (Below 100MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-23
RMS Jitter vs Frequency ( 100MHz - 200MHz) for LVCMOS; TYPICAL 3.3V, 25°C
Figure 6-25
Duty Cycle (%) vs Frequency vs Power Supply; 25°C
Figure 6-27
Duty Cycle (%) vs Frequency Over Temperature Range for LVCMOS; 3.3V
Figure 6-4
Current Consumption vs Frequency
(LVCMOS, 2.5V)
Figure 6-6
Current Consumption vs Frequency
(HCSL, 1.8V)
Figure 6-8
Current Consumption vs Frequency
(HCSL, 3.3V)
Figure 6-10
Current Consumption vs Frequency
(LVPECL, 2.5V)
Figure 6-12
Current Consumption vs Frequency
(LVDS, 1.8V)
Figure 6-14
Current Consumption vs Frequency
(LVDS, 3.3V)
Figure 6-16
RMS Jitter vs Frequency (100MHz to 200MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-18
RMS Jitter vs Frequency (200MHz to 300MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-20
RMS Jitter vs Frequency (300MHz to 400MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-22
RMS Jitter vs Frequency (Below 100MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-24
RMS Jitter vs Frequency ( 10MHz - 100MHz) for LVCMOS; TYPICAL 3.3V, 25°C
Figure 6-26
Duty Cycle (%) vs Temperature vs Power Supply; 50MHz Frequency