SNAS854 February   2023 TDC1000-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information (1)
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Transmitter Signal Path
      2. 8.3.2 Receiver Signal Path
      3. 8.3.3 Low Noise Amplifier (LNA)
      4. 8.3.4 Programmable Gain Amplifier (PGA)
      5. 8.3.5 Receiver Filters
      6. 8.3.6 Comparators for STOP Pulse Generation
        1. 8.3.6.1 Threshold Detector and DAC
        2. 8.3.6.2 Zero-Cross Detect Comparator
        3. 8.3.6.3 Event Manager
      7. 8.3.7 Common-Mode Buffer (VCOM)
      8. 8.3.8 Temperature Sensor
        1. 8.3.8.1 Temperature Measurement With Multiple RTDs
        2. 8.3.8.2 Temperature Measurement With a Single RTD
    4. 8.4 Device Functional Modes
      1. 8.4.1 Time-of-Flight Measurement Mode
        1. 8.4.1.1 Mode 0
        2. 8.4.1.2 Mode 1
        3. 8.4.1.3 Mode 2
      2. 8.4.2 State Machine
      3. 8.4.3 TRANSMIT Operation
        1. 8.4.3.1 Transmission Pulse Count
        2. 8.4.3.2 TX 180° Pulse Shift
        3. 8.4.3.3 Transmitter Damping
      4. 8.4.4 RECEIVE Operation
        1. 8.4.4.1 Single Echo Receive Mode
        2. 8.4.4.2 Multiple Echo Receive Mode
      5. 8.4.5 Timing
        1. 8.4.5.1 Timing Control and Frequency Scaling (CLKIN)
        2. 8.4.5.2 TX/RX Measurement Sequencing and Timing
      6. 8.4.6 Time-of-Flight (TOF) Control
        1. 8.4.6.1 Short TOF Measurement
        2. 8.4.6.2 Standard TOF Measurement
        3. 8.4.6.3 Standard TOF Measurement With Power Blanking
        4. 8.4.6.4 Common-Mode Reference Settling Time
        5. 8.4.6.5 TOF Measurement Interval
      7. 8.4.7 Averaging and Channel Selection
      8. 8.4.8 Error Reporting
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 Chip Select Bar (CSB)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Serial Data Input (SDI)
        4. 8.5.1.4 Serial Data Output (SDO)
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Level and Fluid Identification Measurements
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Level Measurements
          2. 9.2.1.2.2 Fluid Identification
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Water Flow Metering
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Regulations and Accuracy
          2. 9.2.2.2.2 Transit-Time in Ultrasonic Flow Meters
          3. 9.2.2.2.3 ΔTOF Accuracy Requirement Calculation
          4. 9.2.2.2.4 Operation
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

8.4.6.1 Short TOF Measurement

GUID-A350634B-548C-44D9-AE01-11012E5E591D-low.gif
B. If NUM_TX < 3, the width of the START pulse is equal to NUM_TX × T1. If NUM_TX ≥ 3, the width of the START pulse is equal to 3 × T1.
C. Common-mode settling time.
Figure 8-23 Short TOF Measurement

In a short time of flight measurement, the RX path is activated before the TX burst, as shown in #SNAS6489966. The input MUX is automatically swapped to the alternate receive channel before and during the TX burst. Swapping the input prevents the TX burst from being amplified in the RX path. After the TX burst, the input MUX remains switched to the alternate channel for a masking period determined by the SHORT_TOF_BLANK_PERIOD field in the TIMEOUT register. Masking the RX path avoids the issue of amplifying the residual TX ringing of the transducer in the RX path.

The short TOF is the default measurement sequence selected at power on. The short TOF measurement is selected if the value of the TIMING_REG[9:0] field is less than 30, or if the FORCE_SHORT_TOF bit is set to 1. The TIMING_REG[9:0] is a 10-bit wide field, with the two most significant bits located in the TOF_1 register, and the eight least significant bits located in the TOF_0 register. The FORCE_SHORT_TOF bit is located in the TIMEOUT register.

The input offset of the comparator is stored in an internal capacitor during the auto-zero period. The length of the auto-zero period is controlled by the AUTOZERO_PERIOD field in the CLOCK_RATE register.

The length of the window when the comparators are able to qualify and generate STOP pulses is configured by the TOF_TIMEOUT_CTRL field. A timeout will occur if the number of expected pulses is not received during the allocated time and an error condition is reported to the ERROR_FLAGS register and the ERRB pin. It is possible to disable the echo timeout (see GUID-4F856601-720B-4A19-A0D9-476CDD03DF8A.html#TITLE-SNAS648SNAS6484784). The TOF_TIMEOUT_CTRL field is located in the TIMEOUT register.

See the GUID-5999259E-0D5F-4478-AB44-452AB0803101.html#TITLE-SNAS648SNAS6488253 section for the definition of the time periods T0 and T1.