SNAS866A December   2023  – September 2024 LMX1214

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Range of Dividers
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power-On Reset
      2. 6.3.2 Temperature Sensor
      3. 6.3.3 Clock Outputs
        1. 6.3.3.1 Clock Output Buffers
        2. 6.3.3.2 Clock MUX
        3. 6.3.3.3 Clock Divider
      4. 6.3.4 AUXCLK Output
        1. 6.3.4.1 AUXCLKOUT Output Format
        2. 6.3.4.2 AUXCLK_DIV_PRE and AUXCLK_DIV Dividers
      5. 6.3.5 SYNC Input Pins
        1. 6.3.5.1 SYNC Pins Common-Mode Voltage
        2. 6.3.5.2 Windowing Feature
    4. 6.4 Device Functional Modes Configurations
      1. 6.4.1 Pin Mode Control
  8. 7 Register Map
    1. 7.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SYNC Input Configuration
      2. 8.1.2 Treatment of Unused Pins
      3. 8.1.3 Current Consumption
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

6.3.2 Temperature Sensor

The junction temperature can be read back for purposes such as characterization or to make adjustments based on temperature. Such adjustments can include adjusting CLKOUTx_PWR to make the output power more stable or using external or digital delays to compensate for changes in propagation delay over temperature.

The junction temperature is typically higher than the ambient temperature due to power dissipation from the outputs and other functions on the device. Equation 1 shows the relationship between the code read back and the junction temperature.

Equation 1. Temperature = 0.65 × Code – 351

Equation 1 is based on a best-fit line created from three devices from slow, nominal, and fast corner lots (nine parts total). The worst-case variation of the actual temperature from the temperature predicted by the best-fit line is 13°C, which works out to 20 codes.