SNAU291A October   2023  – September 2024

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2EVM Quick Start
    1. 2.1 Hardware Setup
    2. 2.2 Software Setup
      1. 2.2.1 TICS Pro GUI Setup
      2. 2.2.2 Power Up Sequence
    3. 2.3 EVM Measurements
  8. 3Hardware
    1. 3.1 Device Operation Modes
    2. 3.2 EVM Configuration
      1. 3.2.1 Power Supply
      2. 3.2.2 Logic Input and Outputs
      3. 3.2.3 Clock Input
      4. 3.2.4 Clock Outputs
      5. 3.2.5 Status Outputs, LEDs and Test Points
  9. 4Software
    1. 4.1 TICS Pro LMKDB1108 Software
      1. 4.1.1 Input
        1. 4.1.1.1 Input Interface Type
        2. 4.1.1.2 Input Termination
        3. 4.1.1.3 Auto Output Disable (AOD)
        4. 4.1.1.4 LOS Event
        5. 4.1.1.5 LOS Readback
      2. 4.1.2 Device Info and EVM Setup
        1. 4.1.2.1 Device Info
        2. 4.1.2.2 EVM Setup
        3. 4.1.2.3 SMBus
      3. 4.1.3 Output
        1. 4.1.3.1 SMBus
          1. 4.1.3.1.1 Programmable Output Slew Rate Control
        2. 4.1.3.2 OE# Pin Control
        3. 4.1.3.3 Side Band Interface (SBI)
  10. 5Implementation Results
    1. 5.1 Typical Phase Noise Characteristic
  11. 6Hardware Design Files
    1. 6.1 Schematics
    2. 6.2 PCB Layouts
    3. 6.3 Bill of Materials (BOM)
  12. 7Compliance Information
    1. 7.1 Compliance and Certifications
  13. 8References
  14. 9Revision History

PCB Layouts


LMKDB1108EVM Layer Stackup

Figure 6-9 Layer Stackup
LMKDB1108EVM Top Layer (CLKIN / CLKOUT
                    Signals) Figure 6-10 Top Layer (CLKIN / CLKOUT Signals)
LMKDB1108EVM Bottom Layer Figure 6-11 Bottom Layer
LMKDB1108EVM Signal 1 Layer Figure 6-12 Signal 1 Layer
LMKDB1108EVM PWR Layer Figure 6-13 PWR Layer
LMKDB1108EVM GND 1 Layer Figure 6-14 GND 1 Layer
LMKDB1108EVM GND 2 Layer Figure 6-15 GND 2 Layer