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Design Considerations for Heat Sink Monitoring With Ring Lug Thermistors
SNIA053
june 2023
TMP61-Q1
CONTENTS
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Design Considerations for Heat Sink Monitoring With Ring Lug Thermistors
1
Abstract
Trademarks
1
Heat Sink Temperature Sensor Monitoring
2
Test Overview
2.1
Hardware
2.1.1
Keysight E3631A Power Supply
2.1.2
Sorensen DCS 40-25E Programmable DC Power Supply
2.1.3
B&K Precision 8500 DC Electronic Load
2.1.4
TDS3014B Tektronix Digital Oscilloscope
2.1.5
Fluke TiS60+ Thermal Imager
2.1.6
MSP430F5529LP LaunchPad
2.2
Isolated Gate Driver
2.3
IGBT Module
2.4
NTC Ring Lug
2.5
TMP6 Ring Lug
2.6
Schematic
3
Test Implementation
3.1
Data Collected
3.2
Test Results
4
Design Recommendations
4.1
Ring Lugs for the TMP6
4.2
Thermal Epoxy
5
Summary
6
References
IMPORTANT NOTICE
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Application Note
Design Considerations for Heat Sink Monitoring With Ring Lug Thermistors
