SNIA053 june   2023 TMP61-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Heat Sink Temperature Sensor Monitoring
  5. 2Test Overview
    1. 2.1 Hardware
      1. 2.1.1 Keysight E3631A Power Supply
      2. 2.1.2 Sorensen DCS 40-25E Programmable DC Power Supply
      3. 2.1.3 B&K Precision 8500 DC Electronic Load
      4. 2.1.4 TDS3014B Tektronix Digital Oscilloscope
      5. 2.1.5 Fluke TiS60+ Thermal Imager
      6. 2.1.6 MSP430F5529LP LaunchPad
    2. 2.2 Isolated Gate Driver
    3. 2.3 IGBT Module
    4. 2.4 NTC Ring Lug
    5. 2.5 TMP6 Ring Lug
    6. 2.6 Schematic
  6. 3Test Implementation
    1. 3.1 Data Collected
    2. 3.2 Test Results
  7. 4Design Recommendations
    1. 4.1 Ring Lugs for the TMP6
    2. 4.2 Thermal Epoxy
  8. 5Summary
  9. 6References

TMP6 Ring Lug

The TMP61-Q1 is a silicon-based linear thermistor, offering linearity and consistent sensitivity across temperature to enable simple and accurate methods for temperature conversion. The LPG package is a 2-pin through-hole TO-92S package. This package is fit into a JST5.5-S3 ring lug terminal. The LPG packaged TMP61-Q1 is covered with epoxy (MG Chemicals Thermal Epoxy 8329TCM) and wires. Heat-shrink tubing is added to the leads of the device. The specifications of the TMP61-Q1 are as follows: Automotive Q-200 tested, 10 kΩ nominal resistance, 1% resistor tolerance, and –40°C to 170°C operating range.

GUID-78A65607-EA0F-4E15-8FE6-35CAD456DEFB-low.jpg Figure 2-9 TMP6 Ring Lug With Added Epoxy and Heat-shrink Tubing

All of the ring lug style thermistors used in this testing are connected to PCB boards that included bias resistors and pins for powering the thermistor as well as measuring the thermistor voltage. The ring lugs are also sprayed with a matte black paint for the purpose of measuring an accurate temperature when using the Fluke TiS60+ Thermal Imager, as shown in Figure 2-10.

GUID-044FC85C-986F-4014-8426-BC49CB373895-low.jpg Figure 2-10 Ring Lug Thermistor PCBs