SNIA053 june   2023 TMP61-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Heat Sink Temperature Sensor Monitoring
  5. 2Test Overview
    1. 2.1 Hardware
      1. 2.1.1 Keysight E3631A Power Supply
      2. 2.1.2 Sorensen DCS 40-25E Programmable DC Power Supply
      3. 2.1.3 B&K Precision 8500 DC Electronic Load
      4. 2.1.4 TDS3014B Tektronix Digital Oscilloscope
      5. 2.1.5 Fluke TiS60+ Thermal Imager
      6. 2.1.6 MSP430F5529LP LaunchPad
    2. 2.2 Isolated Gate Driver
    3. 2.3 IGBT Module
    4. 2.4 NTC Ring Lug
    5. 2.5 TMP6 Ring Lug
    6. 2.6 Schematic
  6. 3Test Implementation
    1. 3.1 Data Collected
    2. 3.2 Test Results
  7. 4Design Recommendations
    1. 4.1 Ring Lugs for the TMP6
    2. 4.2 Thermal Epoxy
  8. 5Summary
  9. 6References

2.1 Hardware

Figure 2-1 shows the TIDA-020030 hardware and the IGBT module with double-sided cooling. The position of the isolated gate driver, UCC21732-Q1, is also shown. The heat sinks are symmetrically attached to the top and bottom side of the IGBT module for maximum cooling. The isolated barrier on the drive board is outlined by the PCB silkscreen.

GUID-F821D267-7EB1-43AD-950C-5FDC94D309B3-low.jpg Figure 2-1 TIDA-020030 Hardware

Additionally, the following laboratory test equipment is used:

  • DC supplies
  • Programmable DC electronic load
  • Oscilloscope