SNIA053 june   2023 TMP61-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Heat Sink Temperature Sensor Monitoring
  5. 2Test Overview
    1. 2.1 Hardware
      1. 2.1.1 Keysight E3631A Power Supply
      2. 2.1.2 Sorensen DCS 40-25E Programmable DC Power Supply
      3. 2.1.3 B&K Precision 8500 DC Electronic Load
      4. 2.1.4 TDS3014B Tektronix Digital Oscilloscope
      5. 2.1.5 Fluke TiS60+ Thermal Imager
      6. 2.1.6 MSP430F5529LP LaunchPad
    2. 2.2 Isolated Gate Driver
    3. 2.3 IGBT Module
    4. 2.4 NTC Ring Lug
    5. 2.5 TMP6 Ring Lug
    6. 2.6 Schematic
  6. 3Test Implementation
    1. 3.1 Data Collected
    2. 3.2 Test Results
  7. 4Design Recommendations
    1. 4.1 Ring Lugs for the TMP6
    2. 4.2 Thermal Epoxy
  8. 5Summary
  9. 6References

3 Test Implementation

A DC power of 15 V is applied to the signal conditioning board.

An analog PWM signal set to an 80% duty cycle at 15 kHz is applied to the IN+ pin of the UCC21732-Q1. The input waveform is shown in Figure 3-1. The isolated gate driver boosts the input to a 15-V output on OUTA to drive the IGBT Module MOSFETs through pin 13.

GUID-4D103D6C-5CDA-4F19-8713-76B78C5DBE09-low.jpg Figure 3-1 Input PWM Signal
GUID-DF0B34A7-B420-4CC6-AC9E-61F4C41D169D-low.jpg Figure 3-2 Output PWM Driver Signal

The analog inputs from the thermistors are measured to confirm that the correct temperature is reported. The software on the MSP430 converts the analog voltage to a temperature value for both the TMP6 and NTC ring lug thermistors. The temperature is output to the serial monitor, as shown in Figure 3-3.

GUID-FCDB1E42-8023-4EA4-AFA6-3E7C844A3219-low.jpg Figure 3-3 Thermistor Serial Data

After the initial measurements are confirmed, power is applied to the IGBT module. The IGBT module receives 15 V DC and 20 A.


GUID-20230531-SS0I-8T1Q-RFDJ-XDPR6G03SDGR-low.jpg

Figure 3-4 Load and DC Supplies

The oscilloscope measures the switching of the IGBT module and the temperature of the system, particularly the heat sink, which is monitored to make sure changes are occurring. The heat sink temperature steadily increases, increasing the temperature measurements from the ring lug thermistors.

GUID-37871F5B-27F1-42B6-A9C9-A255C259C0C0-low.jpg Figure 3-5 IGBT Module Output
GUID-C78AB982-7566-4BF1-878A-70C7910E597A-low.jpg Figure 3-6 Heat Sink Temperature

The system is allowed to run and the heat sink temperature is monitored as the system begins to rise in temperature. Signal measurements are taken from both ring lug thermistors as well as thermal images of the ring lugs and heat sink.