over operating free-air temperature range (unless otherwise noted)(1)(2)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|
| tPHLD | Differential Propagation Delay High to Low | CL = 15 pF | 1.0 | 1.8 | 3.5 | ns |
| tPLHD | Differential Propagation Delay Low to High | VID = 200 mV | 1.0 | 1.7 | 3.5 | ns |
| tSKD1 | Differential Pulse Skew |tPHLD − tPLHD| (3) | (Figure 5-1 and Figure 5-2) | 0 | 100 | 400 | ps |
| tSKD3 | Differential Part to Part Skew (4) | | 0 | 0.3 | 1.0 | ns |
| tSKD4 | Differential Part to Part Skew (5) | | 0 | 0.4 | 1.5 | ns |
| tTLH | Rise Time | | | 350 | 800 | ps |
| tTHL | Fall Time | | | 175 | 800 | ps |
| fMAX | Maximum Operating Frequency (6) | | 200 | 250 | | MHz |
(1) CL includes probe and jig capacitance.
(2) Generator waveform for all tests unless otherwise specified: f
= 1 MHz, ZO = 50Ω, tr and tf (0% to 100%) ≤ 3
ns for IN±.
(3) tSKD1 is the magnitude difference in differential
propagation delay time between the positive-going-edge and the
negative-going-edge of the same channel.
(4) tSKD3, part to part skew, is the differential
channel-to-channel skew of any event between devices. This specification applies
to devices at the same VDD and within 5°C of each other within the
operating temperature range.
(5) tSKD4, part to part skew, is the differential
channel-to-channel skew of any event between devices. This specification applies
to devices over the recommended operating temperature and voltage ranges, and
across process distribution. tSKD4 is defined as |Max − Min|
differential propagation delay.
(6) fMAX generator input conditions: tr =
tf < 1 ns (0% to 100%), 50% duty cycle, differential (1.05V to
1.35 peak to peak). Output criteria: 60%/40% duty cycle, VOL (max
0.4V), VOH (min 2.4V), load = 15 pF (stray plus probes). The
parameter is ensured by design. The limit is based on the statistical analysis
of the device over the PVT range by the transition times (tTLH and
tTHL).
(7) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits.
Section 4.3 specifies conditions of device operation.
(8) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified (such as VID).
(9) ESD Ratings:
- DS90LV012A:
- HBM (1.5 kΩ, 100 pF) ≥ 2kV
- EIAJ (0Ω, 200 pF) ≥ 900V
- CDM ≥ 2000V
- IEC direct (330Ω, 150 pF) ≥ 5kV
- DS90LT012A:
- HBM (1.5 kΩ, 100 pF) ≥ 2kV
- EIAJ (0Ω, 200 pF) ≥ 700V
- CDM ≥ 2000V
- IEC direct (330Ω, 150 pF) ≥ 7kV
(10) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not exceed maximum junction temperature specification.
(11) VDD is always higher than IN+ and IN− voltage. IN+ and IN− are allowed to have voltage range −0.05V to +2.35V when VDD = 2.7V and |VID| / 2 to VDD − 0.3V when VDD = 3.0V to 3.6V. VID is not allowed to be greater than 100 mV when VCM = 0.05V to 2.35V when VDD = 2.7V or when VCM = |VID| / 2 to VDD − 0.3V when VDD = 3.0V to 3.6V.