SNLS422D July   2012  – August 2017 DS90UB926Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  DC Electrical Characteristics
    6. 7.6  AC Electrical Characteristics
    7. 7.7  DC and AC Serial Control Bus Characteristics
    8. 7.8  Timing Requirements
    9. 7.9  Timing Requirements for the Serial Control Bus
    10. 7.10 Switching Characteristics
    11. 7.11 Timing Diagrams
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  High-Speed Forward Channel Data Transfer
      2. 8.3.2  Low-Speed Back Channel Data Transfer
      3. 8.3.3  Backward-Compatible Mode
      4. 8.3.4  Input Equalization Gain
      5. 8.3.5  Common-Mode Filter Pin (CMF)
      6. 8.3.6  Video Control Signal Filter
      7. 8.3.7  EMI Reduction Features
        1. 8.3.7.1 Spread Spectrum Clock Generation (SSCG)
      8. 8.3.8  Enhanced Progressive Turnon (EPTO)
      9. 8.3.9  LVCMOS VDDIO Option
      10. 8.3.10 Power Down (PDB)
      11. 8.3.11 Stop Stream Sleep
      12. 8.3.12 Serial Link Fault Detect
      13. 8.3.13 Oscillator Output
      14. 8.3.14 Pixel Clock Edge Select (RFB)
      15. 8.3.15 Image Enhancement Features
        1. 8.3.15.1 White Balance
          1. 8.3.15.1.1 LUT Contents
          2. 8.3.15.1.2 Enabling White Balance
        2. 8.3.15.2 Adaptive HI-FRC Dithering
      16. 8.3.16 Internal Pattern Generation
      17. 8.3.17 Built-In Self Test (BIST)
        1. 8.3.17.1 BIST Configuration and Status
          1. 8.3.17.1.1 Sample BIST Sequence
        2. 8.3.17.2 Forward Channel And Back Channel Error Checking
      18. 8.3.18 I2S Receiving
        1. 8.3.18.1 I2S Jitter Cleaning
        2. 8.3.18.2 Secondary I2S Channel
          1. 8.3.18.2.1 MCLK
      19. 8.3.19 Interrupt Pin — Functional Description and Usage (INTB)
      20. 8.3.20 GPIO[3:0] and GPO_REG[8:4]
        1. 8.3.20.1 GPO_REG[8:4] Enable Sequence
    4. 8.4 Device Functional Modes
      1. 8.4.1 Clock-Data Recovery Status Flag (LOCK), Output Enable (OEN) and Output State Select (OSS_SEL)
      2. 8.4.2 Low Frequency Optimization (LFMODE)
      3. 8.4.3 Configuration Select (MODE_SEL)
      4. 8.4.4 Repeater Application
        1. 8.4.4.1 Repeater Connections
    5. 8.5 Programming
      1. 8.5.1 Serial Control Bus
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Display Application
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transmission Media
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Up Requirements and PDB Pin
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 CML Interconnect Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from C Revision (February 2017) to D Revision

  • Reverted all previous MLCK content changes made in Revision C back to Revision BGo
  • Deleted the disable I2S jitter cleaner noteGo

Changes from B Revision (January 2015) to C Revision

  • Changed pin 60 from MCLK to RES2 Go
  • Changed MCLK to RES2 Go
  • Added note to disable I2S jitter cleaner Go
  • Changed MCLK to RES2 Go
  • Deleted reference to MCLK in this section Go
  • Deleted reference to MCLK in this section Go
  • Deleted reference to MCLKGo
  • Changed MCLK section Go
  • Changed MCLK columns of Audio Interface Frequencies table Go
  • Changed the values in columns 2 through 5 in Configuration Select (MODE_SEL) tableGo
  • Changed the values in columns 2 to 5 in Serial Control Bus Addresses for IDx tableGo
  • Changed register reference to MCLK Go
  • Changed Typical Display System Diagram (removed reference to MCLK) Go
  • Changed wording of Power Up Requirements and PDB Pin subsection and added Power-Up Sequence graphicGo

Changes from A Revision (April 2013) to B Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from * Revision (July 2012) to A Revision

  • Corrected typo in table “DC and AC Serial Control Bus Characteristics” from VDDIO to VDD33, added “Note: BIST is not available in backwards compatible mode.”, added Recommended FRC settings table, changed entire layout of Data Sheet to TI format, added to Absolute Maximum Rating section, note (3): The maximum limit (VDDIO +0.3V) does not apply to the PDB pin during the transition to the power down state (PDB transitioning from HIGH to LOW), deleted derate from Maximum Power Dissipation Capacity at 25°C.Go
  • "Note: BIST is not available in backwards compatible mode."Go