SNLS452B November   2014  – August 2019 DS90UB949-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC And AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing for the Serial Control Bus
    9. 6.9  Timing Diagrams
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Definition Multimedia Interface (HDMI)
        1. 7.3.1.1 HDMI Receive Controller
      2. 7.3.2  Transition Minimized Differential Signaling
      3. 7.3.3  Enhanced Display Data Channel
      4. 7.3.4  Extended Display Identification Data (EDID)
        1. 7.3.4.1 External Local EDID (EEPROM)
        2. 7.3.4.2 Internal EDID (SRAM)
        3. 7.3.4.3 External Remote EDID
        4. 7.3.4.4 Internal Pre-Programmed EDID
      5. 7.3.5  Consumer Electronics Control (CEC)
      6. 7.3.6  +5-V Power Signal
      7. 7.3.7  Hot Plug Detect (HPD)
      8. 7.3.8  High-Speed Forward Channel Data Transfer
      9. 7.3.9  Back Channel Data Transfer
      10. 7.3.10 FPD-Link III Port Register Access
      11. 7.3.11 Power Down (PDB)
      12. 7.3.12 Serial Link Fault Detect
      13. 7.3.13 Interrupt Pin (INTB)
      14. 7.3.14 Remote Interrupt Pin (REM_INTB)
      15. 7.3.15 General-Purpose I/O
        1. 7.3.15.1 GPIO[3:0] and D_GPIO[3:0] Configuration
        2. 7.3.15.2 Back Channel Configuration
        3. 7.3.15.3 GPIO_REG[8:5] Configuration
      16. 7.3.16 SPI Communication
        1. 7.3.16.1 SPI Mode Configuration
        2. 7.3.16.2 Forward Channel SPI Operation
        3. 7.3.16.3 Reverse Channel SPI Operation
      17. 7.3.17 Backward Compatibility
      18. 7.3.18 Audio Modes
        1. 7.3.18.1 HDMI Audio
        2. 7.3.18.2 DVI I2S Audio Interface
          1. 7.3.18.2.1 I2S Transport Modes
          2. 7.3.18.2.2 I2S Repeater
        3. 7.3.18.3 AUX Audio Channel
        4. 7.3.18.4 TDM Audio Interface
      19. 7.3.19 Built-In Self Test (BIST)
        1. 7.3.19.1 BIST Configuration And Status
        2. 7.3.19.2 Forward Channel and Back Channel Error Checking
      20. 7.3.20 Internal Pattern Generation
        1. 7.3.20.1 Pattern Options
        2. 7.3.20.2 Color Modes
        3. 7.3.20.3 Video Timing Modes
        4. 7.3.20.4 External Timing
        5. 7.3.20.5 Pattern Inversion
        6. 7.3.20.6 Auto Scrolling
        7. 7.3.20.7 Additional Features
      21. 7.3.21 Spread Spectrum Clock Tolerance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 7.4.2 FPD-Link III Modes of Operation
        1. 7.4.2.1 Single Link Operation
        2. 7.4.2.2 Dual Link Operation
        3. 7.4.2.3 Replicate Mode
        4. 7.4.2.4 Auto-Detection of FPD-Link III Modes
      3. 7.4.3 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
      2. 7.5.2 Multi-Master Arbitration Support
      3. 7.5.3 I2C Restrictions on Multi-Master Operation
      4. 7.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 7.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 7.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High-Speed Interconnect Guidelines
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Application Performance Plots
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging and Orderable Information

5 Pin Configuration and Functions

RGC Package
64-Pin VQFN
Top View
DS90UB949-Q1 UB949_FINAL_PIN_DIAGRAM.gif

Pin Functions

PIN I/O, TYPE DESCRIPTION
NAME NO.
HDMI TMDS INPUT
IN_CLK-
IN_CLK+		 49
50		 I, TMDS TMDS Clock Differential Input
IN_D0-
IN_D0+		 55
56		 I, TMDS TMDS Data Channel 0 Differential Input
IN_D1-
IN_D1+		 59
60		 I, TMDS TMDS Data Channel 1 Differential Input
IN_D2-
IN_D2+		 62
63		 I, TMDS TMDS Data Channel 2 Differential Input
OTHER HDMI
HPD 42 O, Open-Drain Hot Plug Detect Output. Pull up to RX_5V with a 1-kΩ resistor
RX_5V 43 I HDMI 5-V Detect Input
DDC_SDA 44 IO, Open-Drain DDC Slave Serial Data
Pullup to RX_5V with a 47-kΩ resistor
DDC_SCL 45 I, Open-Drain DDC Slave Serial Clock
Pullup to RX_5V with a 47-kΩ resistor
CEC 1 IO, Open-Drain Consumer Electronic Control Channel Input/Output Interface.
Pullup with a 27-kΩ resistor to 3.3 V
X1 39 I, LVCMOS Optional Oscillator Input: This pin is the optional reference clock for CEC. It must be connected to a 25 MHz 0.1% (1000ppm), 45-55% duty cycle clock source at CMOS-level 1.8 V. Leave it open if unused.
FPD-LINK III SERIAL
DOUT0- 26 O FPD-Link III Inverting Output 0
The output must be AC-coupled with a 0.1-µF capacitor for interfacing with 92x deserializers and 33-nF capacitor for 94x deserializers
DOUT0+ 27 O FPD-Link III True Output 0
The output must be AC-coupled with a 0.1-µF capacitor for interfacing with 92x deserializers and 33-nF capacitor for 94x deserializers
DOUT1- 22 O FPD-Link III Inverting Output 1
The output must be AC-coupled with a 0.1-µF capacitor for interfacing with 92x deserializers and 33-nF capacitor for 94x deserializers
DOUT1+ 23 O FPD-Link III True Output 1
The output must be AC-coupled with a 0.1-µF capacitor for interfacing with 92x deserializers and 33-nF capacitor for 94x deserializers
LFT 20 Analog FPD-Link III Loop Filter
Connect to a 10-nF capacitor to GND
CONTROL
SDA 14 IO, Open-Drain I2C Data Input / Output Interface
Open-drain. Must have an external pullup to resistor to 1.8 V or 3.3 V. See I2CSEL pin. DO NOT FLOAT.
Recommended pullup: 4.7 kΩ.
SCL 15 IO, Open-Drain I2C Clock Input / Output Interface
Open-drain. Must have an external pullup resistor to 1.8 V or 3.3 V. See I2CSEL pin. DO NOT FLOAT.
Recommended pullup: 4.7 kΩ.
I2CSEL 6 I, LVCMOS I2C Voltage Level Strap Option
Tie to VDDIO with a 10-kΩ resistor for 1.8-V I2C operation.
Leave floating for 3.3-V I2C operation.
This pin is read as an input at power up.
IDx 19 Analog I2C Serial Control Bus Device ID Address Select
MODE_SEL0 18 Analog Mode Select 0. See Table 6.
MODE_SEL1 32 Analog Mode Select 1. See Table 6.
PDB 31 I, LVCMOS Power-Down Mode Input Pin
INTB 13 O, Open-Drain Open Drain. Remote interrupt. Active LOW.
Pullup to VDDIO with a 4.7-kΩ resistor.
REM_INTB 40 O, Open-Drain Remote interrupt. Mirrors status of INTB_IN from the deserializer.
Note: External pullup to 1.8 V required. Recommended pullup: 4.7 kΩ.
INTB = H, Normal Operation
INTB = L, Interrupt Request
SPI PINS (DUAL LINK MODE ONLY)
MOSI 8 IO, LVCMOS SPI Master Out Slave In. Shared with D_GPIO0
MISO 10 IO, LVCMOS SPI Master In Slave Out. Shared with D_GPIO1
SPLK 11 IO, LVCMOS SPI Clock. Shared with D_GPIO2
SS 12 IO, LVCMOS SPI Slave Select. Shared with D_GPIO3
HIGH-SPEED (HS) BIDIRECTIONAL CONTROL CHANNEL GPIO PINS (DUAL LINK MODE ONLY)
D_GPIO0 8 IO, LVCMOS HS GPIO0. Shared with MOSI
D_GPIO1 10 IO, LVCMOS HS GPIO1. Shared with MISO
D_GPIO2 11 IO, LVCMOS HS GPIO2. Shared with SPLK
D_GPIO3 12 IO, LVCMOS HS GPIO3. Shared with SS
BIDIRECTIONAL CONTROL CHANNEL (BCC) GPIO PINS
GPIO0 4 IO, LVCMOS BCC GPIO0. Shared with SDIN
GPIO1 5 IO, LVCMOS BCC GPIO1. Shared with SWC
GPIO2 37 IO, LVCMOS BCC GPIO2. Shared with I2S_DC
GPIO3 38 IO, LVCMOS BCC GPIO3. Shared with I2S_DD
REGISTER-ONLY GPIO
GPIO5_REG 36 IO, LVCMOS General-Purpose Input/Output 5
Local register control only. Shared with I2S_DB
GPIO6_REG 35 IO, LVCMOS General-Purpose Input/Output 6
Local register control only. Shared with I2S_DA
GPIO7_REG 33 IO, LVCMOS General-Purpose Input/Output 7
Local register control only. Shared with I2S_WC
GPIO8_REG 34 IO, LVCMOS General-Purpose Input/Output 8
Local register control only. Shared with I2S_CLK
SLAVE MODE LOCAL I2S CHANNEL PINS
I2S_WC 33 I, LVCMOS Slave Mode I2S Word Clock Input. Shared with GPIO7_REG
I2S_CLK 34 I, LVCMOS Slave Mode I2S Clock Input. Shared with GPIO8_REG
I2S_DA 35 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO6_REG
I2S_DB 36 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO5_REG
I2S_DC 37 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO2
I2S_DD 38 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO3
AUXILIARY I2S CHANNEL PINS
SWC 5 O, LVCMOS Master Mode I2S Word Clock Output. Shared with GPIO1
SCLK 6 O, LVCMOS Master Mode I2S Clock Output. Shared with I2CSEL. This pin is sampled following power-up as I2CSEL, then it will switch to SCLK operation as an output.
SDIN 4 I, LVCMOS Master Mode I2S Data Input. Shared with GPIO0
MCLK 16 IO, LVCMOS Master Mode I2S System Clock Input/Output
POWER AND GROUND
VTERM 57 Power 3.3-V (±5%) Supply for DC-coupled internal termination OR
1.8-V (±5%) Supply for AC-coupled internal termination
Refer to Figure 25 or Figure 26.
VDD18 24
51
64		 Power 1.8-V (±5%) Analog supply. Refer to Figure 25 or Figure 26.
VDDA11 9 Power 1.1-V (±5%) Analog supply. Refer to Figure 25 or Figure 26.
VDDHA11 52
54
58
61		 Power 1.1-V (±5%) TMDS supply. Refer to Figure 25 or Figure 26.
VDDHS11 21
28		 Power 1.1-V (±5%) supply. Refer to Figure 25 or Figure 26.
VDDL11 7
41		 Power 1.1-V (±5%) Digital supply. Refer to Figure 25 or Figure 26.
VDDP11 17 Power 1.1-V (±5%) PLL supply. Refer to Figure 25 or Figure 26.
VDDS11 25 Power 1.1-V (±5%) Serializer supply. Refer to Figure 25 or Figure 26.
VDDIO 3
46		 Power 1.8-V (±5%) IO supply. Refer to Figure 25 or Figure 26.
GND Thermal Pad GND Ground. Connect to Ground plane with at least 9 vias.
OTHER
RES0
RES1		 2
29		 Reserved. Tie to GND.
RES2 30 Reserved. Connect with 50Ω to GND.
NC0
NC1
NC2		 47
48
53		 No connect. Leave floating. Do not connect to VDD or GND.