SNLS504E October   2015  – May 2024 DP83867CS , DP83867E , DP83867IS

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
    2. 5.2 Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Power-Up Timing
    7. 6.7  Reset Timing
    8. 6.8  MII Serial Management Timing
    9. 6.9  SGMII Timing
    10. 6.10 RGMII Timing
    11. 6.11 DP83867E Start of Frame Detection Timing
    12. 6.12 DP83867IS/CS Start of Frame Detection Timing
    13. 6.13 Timing Diagrams
    14. 6.14 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 WoL (Wake-on-LAN) Packet Detection
        1. 7.3.1.1 Magic Packet Structure
        2. 7.3.1.2 Magic Packet Example
        3. 7.3.1.3 Wake-on-LAN Configuration and Status
      2. 7.3.2 Start of Frame Detect for IEEE 1588 Time Stamp
        1. 7.3.2.1 SFD Latency Variation and Determinism
          1. 7.3.2.1.1 1000Mb SFD Variation in Master Mode
          2. 7.3.2.1.2 1000Mb SFD Variation in Slave Mode
          3. 7.3.2.1.3 100Mb SFD Variation
      3. 7.3.3 Clock Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 MAC Interfaces
        1. 7.4.1.1 Serial GMII (SGMII)
        2. 7.4.1.2 Reduced GMII (RGMII)
          1. 7.4.1.2.1 1000Mbps Mode Operation
          2. 7.4.1.2.2 1000Mbps Mode Timing
          3. 7.4.1.2.3 10- and 100Mbps Mode
      2. 7.4.2 Serial Management Interface
        1. 7.4.2.1 Extended Address Space Access
          1. 7.4.2.1.1 Write Address Operation
          2. 7.4.2.1.2 Read Address Operation
          3. 7.4.2.1.3 Write (No Post Increment) Operation
          4. 7.4.2.1.4 Read (No Post Increment) Operation
          5. 7.4.2.1.5 Write (Post Increment) Operation
          6. 7.4.2.1.6 Read (Post Increment) Operation
          7. 7.4.2.1.7 Example of Read Operation Using Indirect Register Access
          8. 7.4.2.1.8 Example of Write Operation Using Indirect Register Access
      3. 7.4.3 Auto-Negotiation
        1. 7.4.3.1 Speed and Duplex Selection - Priority Resolution
        2. 7.4.3.2 Master and Slave Resolution
        3. 7.4.3.3 Pause and Asymmetrical Pause Resolution
        4. 7.4.3.4 Next Page Support
        5. 7.4.3.5 Parallel Detection
        6. 7.4.3.6 Restart Auto-Negotiation
        7. 7.4.3.7 Enabling Auto-Negotiation Through Software
        8. 7.4.3.8 Auto-Negotiation Complete Time
        9. 7.4.3.9 Auto-MDIX Resolution
      4. 7.4.4 Loopback Mode
        1. 7.4.4.1 Near-End Loopback
          1. 7.4.4.1.1 MII Loopback
          2. 7.4.4.1.2 PCS Loopback
          3. 7.4.4.1.3 Digital Loopback
          4. 7.4.4.1.4 Analog Loopback
        2. 7.4.4.2 External Loopback
        3. 7.4.4.3 Far-End (Reverse) Loopback
      5. 7.4.5 BIST Configuration
      6. 7.4.6 Cable Diagnostics
        1. 7.4.6.1 TDR
        2. 7.4.6.2 Energy Detect
        3. 7.4.6.3 Fast Link Detect
        4. 7.4.6.4 Speed Optimization
        5. 7.4.6.5 Mirror Mode
        6. 7.4.6.6 Interrupt
        7. 7.4.6.7 IEEE 802.3 Test Modes
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
      2. 7.5.2 LED Configuration
      3. 7.5.3 LED Operation From 1.8V I/O VDD Supply
      4. 7.5.4 PHY Address Configuration
      5. 7.5.5 Reset Operation
        1. 7.5.5.1 Hardware Reset
        2. 7.5.5.2 IEEE Software Reset
        3. 7.5.5.3 Global Software Reset
        4. 7.5.5.4 Global Software Restart
        5. 7.5.5.5 PCS Restart
      6. 7.5.6 Power-Saving Modes
        1. 7.5.6.1 IEEE Power Down
        2. 7.5.6.2 Deep Power-Down Mode
        3. 7.5.6.3 Active Sleep
        4. 7.5.6.4 Passive Sleep
    6. 7.6 Register Maps
      1. 7.6.1   Basic Mode Control Register (BMCR)
      2. 7.6.2   Basic Mode Status Register (BMSR)
      3. 7.6.3   PHY Identifier Register #1 (PHYIDR1)
      4. 7.6.4   PHY Identifier Register #2 (PHYIDR2)
      5. 7.6.5   Auto-Negotiation Advertisement Register (ANAR)
      6. 7.6.6   Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
      7. 7.6.7   Auto-Negotiate Expansion Register (ANER)
      8. 7.6.8   Auto-Negotiation Next Page Transmit Register (ANNPTR)
      9. 7.6.9   Auto-Negotiation Next Page Receive Register (ANNPRR)
      10. 7.6.10  1000BASE-T Configuration Register (CFG1)
      11. 7.6.11  Status Register 1 (STS1)
      12. 7.6.12  Extended Register Addressing
        1. 7.6.12.1 Register Control Register (REGCR)
        2. 7.6.12.2 Address or Data Register (ADDAR)
      13. 7.6.13  1000BASE-T Status Register (1KSCR)
      14. 7.6.14  PHY Control Register (PHYCR)
      15. 7.6.15  PHY Status Register (PHYSTS)
      16. 7.6.16  MII Interrupt Control Register (MICR)
      17. 7.6.17  Interrupt Status Register (ISR)
      18. 7.6.18  Configuration Register 2 (CFG2)
      19. 7.6.19  Receiver Error Counter Register (RECR)
      20. 7.6.20  BIST Control Register (BISCR)
      21. 7.6.21  Status Register 2 (STS2)
      22. 7.6.22  LED Configuration Register 1 (LEDCR1)
      23. 7.6.23  LED Configuration Register 2 (LEDCR2)
      24. 7.6.24  LED Configuration Register (LEDCR3)
      25. 7.6.25  Configuration Register 3 (CFG3)
      26. 7.6.26  Control Register (CTRL)
      27. 7.6.27  Testmode Channel Control (TMCH_CTRL)
      28. 7.6.28  Robust Auto MDIX Timer Configuration Register (AMDIX_TMR_CFG)
      29. 7.6.29  Fast Link Drop Configuration Register (FLD_CFG)
      30. 7.6.30  Fast Link Drop Threshold Configuration Register (FLD_THR_CFG)
      31. 7.6.31  Configuration Register 4 (CFG4)
      32. 7.6.32  RGMII Control Register (RGMIICTL)
      33. 7.6.33  RGMII Control Register 2 (RGMIICTL2)
      34. 7.6.34  SGMII Auto-Negotiation Status (SGMII_ANEG_STS)
      35. 7.6.35  100BASE-TX Configuration (100CR)
      36. 7.6.36  Viterbi Module Configuration (VTM_CFG)
      37. 7.6.37  Skew FIFO Status (SKEW_FIFO)
      38. 7.6.38  Strap Configuration Status Register 1 (STRAP_STS1)
      39. 7.6.39  Strap Configuration Status Register 2 (STRAP_STS2)
      40. 7.6.40  BIST Control and Status Register 1 (BICSR1)
      41. 7.6.41  BIST Control and Status Register 2 (BICSR2)
      42. 7.6.42  BIST Control and Status Register 3 (BICSR3)
      43. 7.6.43  BIST Control and Status Register 4 (BICSR4)
      44. 7.6.44  Configuration for Receiver's Equalizer (CRE)
      45. 7.6.45  RGMII Delay Control Register (RGMIIDCTL)
      46. 7.6.46  ANA_LD_TXG_FINE_GAINSEL_AB (ALTFGAB)
      47. 7.6.47  ANA_LD_TXG_FINE_GAINSEL_CD (ALTFGCD)
      48. 7.6.48  ANA_LD_FILTER_TUNE_AB (ALFTAB)
      49. 7.6.49  ANA_LD_FILTER_TUNE_CD (ALFTCD)
      50. 7.6.50  Configuration of Receiver's LPF (CRLPF)
      51. 7.6.51  Enable Control of Receiver's Equalizer (ECRE)
      52. 7.6.52  PLL Clock-out Control Register (PLLCTL)
      53. 7.6.53  SGMII Control Register 1 (SGMIICTL1)
      54. 7.6.54  Sync FIFO Control (SYNC_FIFO_CTRL)
      55. 7.6.55  Loopback Configuration Register (LOOPCR)
      56. 7.6.56  DSP Configuration (DSP_CONFIG)
      57. 7.6.57  DSP Feedforward Equalizer Configuration (DSP_FFE_CFG)
      58. 7.6.58  Receive Configuration Register (RXFCFG)
      59. 7.6.59  Receive Status Register (RXFSTS)
      60. 7.6.60  Pattern Match Data Register 1 (RXFPMD1)
      61. 7.6.61  Pattern Match Data Register 2 (RXFPMD2)
      62. 7.6.62  Pattern Match Data Register 3 (RXFPMD3)
      63. 7.6.63  SecureOn Pass Register 2 (RXFSOP1)
      64. 7.6.64  SecureOn Pass Register 2 (RXFSOP2)
      65. 7.6.65  SecureOn Pass Register 3 (RXFSOP3)
      66. 7.6.66  Receive Pattern Register 1 (RXFPAT1)
      67. 7.6.67  Receive Pattern Register 2 (RXFPAT2)
      68. 7.6.68  Receive Pattern Register 3 (RXFPAT3)
      69. 7.6.69  Receive Pattern Register 4 (RXFPAT4)
      70. 7.6.70  Receive Pattern Register 5 (RXFPAT5)
      71. 7.6.71  Receive Pattern Register 6 (RXFPAT6)
      72. 7.6.72  Receive Pattern Register 7 (RXFPAT7)
      73. 7.6.73  Receive Pattern Register 8 (RXFPAT8)
      74. 7.6.74  Receive Pattern Register 9 (RXFPAT9)
      75. 7.6.75  Receive Pattern Register 10 (RXFPAT10)
      76. 7.6.76  Receive Pattern Register 11 (RXFPAT11)
      77. 7.6.77  Receive Pattern Register 12 (RXFPAT12)
      78. 7.6.78  Receive Pattern Register 13 (RXFPAT13)
      79. 7.6.79  Receive Pattern Register 14 (RXFPAT14)
      80. 7.6.80  Receive Pattern Register 15 (RXFPAT15)
      81. 7.6.81  Receive Pattern Register 16 (RXFPAT16)
      82. 7.6.82  Receive Pattern Register 17 (RXFPAT17)
      83. 7.6.83  Receive Pattern Register 18 (RXFPAT18)
      84. 7.6.84  Receive Pattern Register 19 (RXFPAT19)
      85. 7.6.85  Receive Pattern Register 20 (RXFPAT20)
      86. 7.6.86  Receive Pattern Register 21 (RXFPAT21)
      87. 7.6.87  Receive Pattern Register 22 (RXFPAT22)
      88. 7.6.88  Receive Pattern Register 23 (RXFPAT23)
      89. 7.6.89  Receive Pattern Register 24 (RXFPAT24)
      90. 7.6.90  Receive Pattern Register 25 (RXFPAT25)
      91. 7.6.91  Receive Pattern Register 26 (RXFPAT26)
      92. 7.6.92  Receive Pattern Register 27 (RXFPAT27)
      93. 7.6.93  Receive Pattern Register 28 (RXFPAT28)
      94. 7.6.94  Receive Pattern Register 29 (RXFPAT29)
      95. 7.6.95  Receive Pattern Register 30 (RXFPAT30)
      96. 7.6.96  Receive Pattern Register 31 (RXFPAT31)
      97. 7.6.97  Receive Pattern Register 32 (RXFPAT32)
      98. 7.6.98  Receive Pattern Byte Mask Register 1 (RXFPBM1)
      99. 7.6.99  Receive Pattern Byte Mask Register 2 (RXFPBM2)
      100. 7.6.100 Receive Pattern Byte Mask Register 3 (RXFPBM3)
      101. 7.6.101 Receive Pattern Byte Mask Register 4 (RXFPBM4)
      102. 7.6.102 Receive Pattern Control (RXFPATC)
      103. 7.6.103 10M SGMII Configuration (10M_SGMII_CFG)
      104. 7.6.104 I/O Configuration (IO_MUX_CFG)
      105. 7.6.105 GPIO Mux Control Register (GPIO_MUX_CTRL)
      106. 7.6.106 TDR General Configuration Register 1 (TDR_GEN_CFG1)
      107. 7.6.107 TDR Peak Locations Register 1 (TDR_PEAKS_LOC_1)
      108. 7.6.108 TDR Peak Locations Register 2 (TDR_PEAKS_LOC_2)
      109. 7.6.109 TDR Peak Locations Register 3 (TDR_PEAKS_LOC_3)
      110. 7.6.110 TDR Peak Locations Register 4 (TDR_PEAKS_LOC_4)
      111. 7.6.111 TDR Peak Locations Register 5 (TDR_PEAKS_LOC_5)
      112. 7.6.112 TDR Peak Locations Register 6 (TDR_PEAKS_LOC_6)
      113. 7.6.113 TDR Peak Locations Register 7 (TDR_PEAKS_LOC_7)
      114. 7.6.114 TDR Peak Locations Register 8 (TDR_PEAKS_LOC_8)
      115. 7.6.115 TDR Peak Locations Register 9 (TDR_PEAKS_LOC_9)
      116. 7.6.116 TDR Peak Locations Register 10 (TDR_PEAKS_LOC_10)
      117. 7.6.117 TDR Peak Amplitudes Register 1 (TDR_PEAKS_AMP_1)
      118. 7.6.118 TDR Peak Amplitudes Register 2 (TDR_PEAKS_AMP_2)
      119. 7.6.119 TDR Peak Amplitudes Register 3 (TDR_PEAKS_AMP_3)
      120. 7.6.120 TDR Peak Amplitudes Register 4 (TDR_PEAKS_AMP_4)
      121. 7.6.121 TDR Peak Amplitudes Register 5 (TDR_PEAKS_AMP_5)
      122. 7.6.122 TDR Peak Amplitudes Register 6 (TDR_PEAKS_AMP_6)
      123. 7.6.123 TDR Peak Amplitudes Register 7 (TDR_PEAKS_AMP_7)
      124. 7.6.124 TDR Peak Amplitudes Register 8 (TDR_PEAKS_AMP_8)
      125. 7.6.125 TDR Peak Amplitudes Register 9 (TDR_PEAKS_AMP_9)
      126. 7.6.126 TDR Peak Amplitudes Register 10 (TDR_PEAKS_AMP_10)
      127. 7.6.127 TDR General Status (TDR_GEN_STATUS)
      128. 7.6.128 TDR Peak Sign AB (TDR_PEAK_SIGN_A_B)
      129. 7.6.129 TDR Peak Sign CD (TDR_PEAK_SIGN_C_D)
      130. 7.6.130 Programmable Gain Register (PROG_GAIN)
      131. 7.6.131 MMD3 PCS Control Register (MMD3_PCS_CTRL)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Cable Line Driver
        2. 8.2.1.2 Clock In (XI) Recommendation
        3. 8.2.1.3 Crystal Recommendations
        4. 8.2.1.4 Clock Out (CLK_OUT) Phase Noise
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 MAC Interface
          1. 8.2.2.1.1 SGMII Layout Guidelines
          2. 8.2.2.1.2 RGMII Layout Guidelines
        2. 8.2.2.2 Media Dependent Interface (MDI)
          1. 8.2.2.2.1 MDI Layout Guidelines
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Traces
        2. 8.4.1.2 Return Path
        3. 8.4.1.3 Transformer Layout
        4. 8.4.1.4 Metal Pour
        5. 8.4.1.5 PCB Layer Stacking
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.1 Pin Functions

PINTYPE(1)DESCRIPTION
NAMENO.
MAC INTERFACES (SGMII, RGMII)
TX_D325I, PDTRANSMIT DATA Bit 3: This signal carries data from the MAC to the PHY in RGMII mode. It is synchronous to the transmit clock GTX_CLK.
TX_D226I, PDTRANSMIT DATA Bit 2: This signal carries data from the MAC to the PHY in RGMII mode. It is synchronous to the transmit clock GTX_CLK.
SGMII_SIP27I, PDDifferential SGMII Data Input: This signal carries data from the MAC to the PHY in SGMII mode. It is synchronous to the differential SGMII clock input.
This pin should be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
TX_D127I, PDTRANSMIT DATA Bit 1: This signal carries data from the MAC to the PHY in RGMII mode. It is synchronous to the transmit clock GTX_CLK.
SGMII_SIN28I, PDDifferential SGMII Data Input: This signal carries data from the MAC to the PHY in SGMII mode. It is synchronous to the differential SGMII clock input.
This pin should be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
TX_D028I, PDTRANSMIT DATA Bit 0: This signal carries data from the MAC to the PHY in RGMII mode. It is synchronous to the transmit clock GTX_CLK.
GTX_CLK29I, PDRGMII TRANSMIT CLOCK: This continuous clock signal is sourced from the MAC layer to the PHY. Nominal frequency is 125MHz.
RX_CLK32ORGMII RECEIVE CLOCK: Provides the recovered receive clocks for different modes of operation:
2.5MHz in 10Mbps mode.
25MHz in 100Mbps mode.
125MHz in 1000Mbps mode.
SGMII_COP33S, ODifferential SGMII Clock Output: This signal is a continuous 625MHz clock signal driven by the PHY in SGMII mode.
This pin should be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D033S, O, PDRECEIVE DATA Bit 0: This signal carries data from the PHY to the MAC in RGMII mode. It is synchronous to the receive clock RX_CLK.
SGMII_CON34S, O, PDDifferential SGMII Clock Output: This signal is a continuous 625MHz clock signal driven by the MAC in SGMII mode.
This pin should be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D134O, PDRECEIVE DATA Bit 1: This signal carries data from the PHY to the MAC in RGMII mode. It is synchronous to the receive clock RX_CLK.
SGMII_SOP35S, O, PDDifferential SGMII Data Output: This signal carries data from the PHY to the MAC in SGMII mode. It is synchronous to the differential SGMII clock output.
This pin should be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D235S, O, PDRECEIVE DATA Bit 2: This signal carries data from the PHY to the MAC in RGMII mode. It is synchronous to the receive clock RX_CLK.
SGMII_SON36S, O, PDDifferential SGMII Data Output: This signal carries data from the PHY to the MAC in SGMII mode. It is synchronous to the differential SGMII clock output.
This pin should be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D336O, PDRECEIVE DATA Bit 3: This signal carries data from the PHY to the MAC in RGMII mode. It is synchronous to the receive clock RX_CLK.
TX_CTRL37I, PDTRANSMIT CONTROL: In RGMII mode, it combines the transmit enable and the transmit error signals of GMII mode using both clock edges.
RX_CTRL38S, O, PDRECEIVE CONTROL: In RGMII mode, the receive data available and receive error are combined (RXDV_ER) using both rising and falling edges of the receive clock (RX_CLK).
GENERAL-PURPOSE I/O
GPIO_039S, O, PDGeneral-Purpose I/O: This signal provides a multi-function configurable I/O. Refer to the GPIO_MUX_CTRL register for details.
GPIO_140S, O, PDGeneral-Purpose I/O: This signal provides a multi-function configurable I/O. Refer to the GPIO_MUX_CTRL register for details.
MANAGEMENT INTERFACE
MDC16I, PDMANAGEMENT DATA CLOCK: Synchronous clock to the MDIO serial management input and output data. This clock may be asynchronous to the MAC transmit and receive clocks. The maximum clock rate is 25MHz and no minimum.
MDIO17I/OMANAGEMENT DATA I/O: Bidirectional management instruction and data signal that may be sourced by the management station or the PHY. This pin requires pullup resistor. The IEEE specified resistor value is 1.5kΩ, but a 2.2kΩ is acceptable.
INT / PWDN44I/O, PUINTERRUPT / POWER DOWN:
The default function of this pin is POWER DOWN.
POWER DOWN: This is an Active Low Input. Asserting this signal low enables the power-down mode of operation. In this mode, the device powers down and consume minimum power. Register access is available through the Management Interface to configure and power up the device.
INTERRUPT: When operating this pin as an interrupt, it is an open-drain architecture. TI recommends using an external 2.2kΩ resistor connected to the VDDIO supply.
RESET
RESET_N43I, PURESET: The active low RESET initializes or reinitializes the DP83867. All internal registers re-initialize to their default state upon assertion of RESET. The RESET input must be held low for a minimum of 1µs.
CLOCK INTERFACE
XI15ICRYSTAL/OSCILLATOR INPUT: 25MHz oscillator or crystal input (50 ppm)
XO14OCRYSTAL OUTPUT: Second terminal for 25MHz crystal. Must be left floating if a clock oscillator is used.
CLK_OUT18OCLOCK OUTPUT: Output clock
JTAG INTERFACE
JTAG_CLK20I, PUJTAG TEST CLOCK: IEEE 1149.1 Test Clock input, primary clock source for all test logic input and output controlled by the testing entity.
JTAG_TDO21OJTAG TEST DATA OUTPUT: IEEE 1149.1 Test Data Output pin, the most recent test results are scanned out of the device through TDO.
JTAG_TMS22I, PUJTAG TEST MODE SELECT: IEEE 1149.1 Test Mode Select pin, the TMS pin sequences the Tap Controller (16-state FSM) to select the desired test instruction. TI recommends applying 3 clock cycles with JTAG_TMS high to reset the JTAG.
JTAG_TDI23I, PUJTAG TEST DATA INPUT: IEEE 1149.1 Test Data Input pin, test data is scanned into the device through TDI.
LED INTERFACE
LED_245S, I/O, PDLED_2: By default, this pin indicates receive or transmit activity. Additional functionality is configurable through LEDCR1[11:8] register bits.
LED_146S, I/O, PDLED_1: By default, this pin indicates that 1000BASE-T link is established. Additional functionality is configurable through LEDCR1[7:4] register bits.
LED_047S, I/O, PDLED_0: By default, this pin indicates that link is established. Additional functionality is configurable through LEDCR1[3:0] register bits.
MEDIA DEPENDENT INTERFACE
TD_P_A1ADifferential Transmit and Receive Signals
TD_M_A2ADifferential Transmit and Receive Signals
TD_P_B4ADifferential Transmit and Receive Signals
TD_M_B5ADifferential Transmit and Receive Signals
TD_P_C7ADifferential Transmit and Receive Signals
TD_M_C8ADifferential Transmit and Receive Signals
TD_P_D10ADifferential Transmit and Receive Signals
TD_M_D11ADifferential Transmit and Receive Signals
OTHER PINS
RBIAS12ABias Resistor Connection. A 11kΩ ±1% resistor should be connected from RBIAS to GND.
POWER AND GROUND PINS
VDDA2P53, 9P2.5V Analog Supply (±5%). Each pin requires a 1µF and 0.1µF capacitor to GND.
VDD1P06, 24, 31, 42P1V Analog Supply (+15.5%, –5%). Each pin requires a 1µF and 0.1µF capacitor to GND.
VDDA1P813, 48P1.8V Analog Supply (±5%).
No external supply is required for this pin. When unused, no connections should be made to this pin.
For additional power savings, an external 1.8V supply can be connected to these pins. When using an external supply, each pin requires a 1µF and 0.1µF capacitor to GND.
VDDIO19, 30, 41PI/O Power: 1.8V (±5%), 2.5V (±5%) or 3.3V (±5%). Each pin requires a 1µF and 0.1µF capacitor to GND
GNDDie Attach PadPGround
(1)

The definitions below define the functionality of each pin.

  • Type: I Input
  • Type: O Output
  • Type: I/O Input/Output
  • Type: PD, PU Internal Pulldown/Pullup
  • Type: S Configuration Pin
  • Type: P Power or GND
  • Type: A Analog pins