SNLS648C February   2019  – August 2024 TUSB2E22

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Requirements
  7. Parametric Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 2.0
      2. 7.3.2 eUSB2
      3. 7.3.3 Cross MUX
    4. 7.4 Device Functional Modes
      1. 7.4.1 Repeater Mode
      2. 7.4.2 Power Down Mode
      3. 7.4.3 CROSS
  9. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Dual Port System Implementation
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up Reset
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Example YCG Layout For Application With No Cross MUX Function.
      3. 8.4.3 Example RZA Layout For Application With No Cross MUX Function
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Supply voltage rangeVDD3V3 –0.34.32V
Analog Supply voltage rangeVDD1V8–0.32.1V
Voltage rangeDPA, DNA, DPB, DNB , 1000 total number of short events and cumulative duration of 1000 hrs.  –0.36V
Voltage rangeeDP0, eDN0, eDP1, eDN1–0.31.6V
Voltage rangeCROSS, RESETB, RSVD1, RSVD2, RSVD3, EQ1, EQ0–0.32.1V
Junction temperatureTJ(max)125°C
Storage temperatureTstg–65150°C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.