SNLU349 October   2024

 

  1.   1
  2.   Description
  3. 1Features
  4.   4
  5.   Trademarks
  6. 2Evaluation Module Overview
    1.     Preface: Read This First
      1. 2.1.1 Sitara MCU+ Academy
      2. 2.1.2 If You Need Assistance
    2. 2.1 Introduction
    3. 2.2 Kit Contents
    4. 2.3 Specifications
    5. 2.4 Device Information
  7. 3Hardware
    1. 3.1 Power Tree
    2. 3.2 Test Points
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials (BOM)
  9. 5Revision History

PCB Layout

Figure 4-1 through Figure 4-4 show the design of the DP83TC812-IND-SPE EVM using a six-layer PCB with 2oz copper thickness.

DP83TC812-IND-SPE Top Overlay Figure 4-5 Top Overlay
DP83TC812-IND-SPE Top Solder Figure 4-6 Top Solder
DP83TC812-IND-SPE Layer 1 Figure 4-7 Layer 1
DP83TC812-IND-SPE Layer 2 Figure 4-8 Layer 2
DP83TC812-IND-SPE Layer 3 Figure 4-9 Layer 3
DP83TC812-IND-SPE Layer 4 Figure 4-10 Layer 4
DP83TC812-IND-SPE Layer 5 Figure 4-11 Layer 5
DP83TC812-IND-SPE Layer 6 Figure 4-12 Layer 6
DP83TC812-IND-SPE Layer 7 Figure 4-13 Layer 7
DP83TC812-IND-SPE Layer 8 Figure 4-14 Layer 8
DP83TC812-IND-SPE Bottom Solder Figure 4-15 Bottom Solder
DP83TC812-IND-SPE Bottom Overlay Figure 4-16 Bottom Overlay
DP83TC812-IND-SPE Drill Drawing Figure 4-17 Drill Drawing
DP83TC812-IND-SPE M2 Board Dimensions Figure 4-18 M2 Board Dimensions