SNOK003 September 2021 LM74700-EP
A new device can be qualified either by performing full scale quality and reliability tests on the actual device or using previously qualified device(s) through "Qualification by Similarity" (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests will be eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameters or package shall define which attributes are required to remain fixed in order for the QBS rules to apply. The attributes which are expected and allowed to vary will be reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for conformance to the QBS rule sets applicable to that device. See JEDEC JESD47 for more information.
| Device Baseline(1) | |
|---|---|
| TI Device: | LM74700MDDFREP |
| DLA VID: | V62/21608 |
| Moisture Sensitivity: | MSL 2 / 260°C |
| ESD CDM: | ±750 V (corner pins) ±500 V (other pins) |
| ESD HBM: | ±2000 V |
| Enhanced Products New Device Qualification Matrix (Note that qualification by similarity ("qualification family") per JEDEC JESD47 is allowed) | ||||
|---|---|---|---|---|
| Description | Condition | Sample Size (Allowed Rejects) | Lots Required | Test Method |
| Electromigration | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
| Wire Bond Life | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
| Electrical Characterization | TI Data Sheet | 15 | 3 | N/A |
| Electrostatic Discharge Sensitivity | HBM | 3 units/voltage | N/A | EIA/JESD22-A114 or ANSI/ESDA/JEDEC JS-001 |
| CDM | EIA/JESD22-C101 or ANSI/ESDA/JEDEC JS-002 | |||
| Latch-up | Per Technology | 3(0) | 1 | EIA/JESD78 |
| Physical Dimensions | TI Data Sheet | 5(0) | 1 | EIA/JESD22- B100 |
| Thermal Impedance | Theta-JA on board | Per Pin-Package | N/A | EIA/JESD51 |
| Bias Life Test | 125°C/1000 hours or equivalent | 45(0) | 3 | JESD22-A108(1) |
| Biased Humidity | 85°C/85%/1000 hours | 77(0) | 3 | JESD22-A101(1) |
| or | ||||
| Biased HAST | 130°C/85%/96 hours or 110°C/85%/264 hours | JESD22-A110(1) | ||
| Extended Biased Humidity(2) | 85°C/85%/2600 hours | 77(-) | 1 | JESD22-A101(1) |
| or | ||||
| Extended Biased HAST(2) | 130°C/85%/250 hours or 110°C/85%/687 hours | JESD22-A110(1) | ||
| Unbiased HAST | 130°C/85%/96 hours or 110°C/85%/264 hours | 77(0) | 3 | JESD22-A.118(1) |
| Temperature Cycle | -65°C to +150°C non-biased for 500 cycles | 77(0) | 3 | JESD22-A104(1) |
| Solder Heat | 260°C for 10 seconds | 22(0) | 1 | JESD22-B106 |
| Resistance to Solvents | Ink symbol only | 12(0) | 1 | JESD22-B107 |
| Solderability | Bake Preconditioning | 22(0) | 1 | ANSI/J-STD-002 |
| Flammability | Method A / Method B | 5(0) | 1 | UL94 |
| Bond Shear | Per wire size | 5 units x 30(0) bonds | 3 | JESD22-B116 |
| Bond Pull Strength | Per wire size | 5 units x 30(0) bonds | 3 | ASTM F-459 or TM2011 |
| Die Shear | Per die size | 5(0) | 3 | TM 2019 |
| High Temp Storage | 150 °C / 1,000 hours | 15(0) | 3 | JESD22-A103(1) |
| Moisture Sensitivity | Surface Mount Only | 12 | 1 | J-STD-020(1) |
| Technology Family FIT / MTBF Data |
|---|
Mean Time Between Fails (MTBF) and Failures in Time (FIT) rates are device reliability statistics calculated based on data collected from TI’s internal reliability testing (life test). TI’s DPPM/FIT/MTBF Estimator Search Tool reports the generic data based on technology groupings and shows conditions under which the rates were derived. All terms used in the tool and definitions can be found on the TI reliability terminology page. Failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested, therefore, it is not recommended to compare failure rates. |
TI DPPM/FIT/MTBF Estimator Search Tool webpage link: |
| Device Family Qualification Data |
|---|
TI’s Qualification Summary Search Tool reports generic qualification data representative of the material sets, processes, and manufacturing sites used by the device family and may not include all of the testing performed for a specific EP device. Please see the Enhanced Products New Device Qualification Matrix above for the full suite of qualification testing performed to release Enhanced Product devices. |
TI Qualification Summary Search webpage link: |
| Ongoing Reliability Monitoring |
|---|
TI periodically monitors the reliability of its products, wafer fab processes, and package technologies, through its Ongoing Reliability Monitor (ORM) program. The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report. |
TI Ongoing Reliability Monitoring Search webpage link: |
For additional information or technical support please contact the Texas Instruments Customer Support Center at www.ti.com/csc For more information on TI Enhanced Products please visit www.ti.com/ep